TY - GEN
T1 - 34.6 A 28nm 72.12TFLOPS/W Hybrid-Domain Outer-Product Based Floating-Point SRAM Computing-in-Memory Macro with Logarithm Bit-Width Residual ADC
AU - Yuan, Yiyang
AU - Yang, Yiming
AU - Wang, Xinghua
AU - Li, Xiaoran
AU - Ma, Cailian
AU - Chen, Qirui
AU - Tang, Meini
AU - Wei, Xi
AU - Hou, Zhixian
AU - Zhu, Jialiang
AU - Wu, Hao
AU - Ren, Qirui
AU - Xing, Guozhong
AU - Mak, Pui In
AU - Zhang, Feng
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - SRAM-based computing-in-memory (CIM) is considered crucial to achieving high-energy efficiency (EF) for artificial-intelligence (AI) applications on edge devices. Researchers are currently exploring floating-point (FP) CIM [1], [2], as integer (INT) precision CIMs [3] -[6] are no longer sufficient for new AI applications, which demand increased accuracy, complexity, and on-chip training. However, both analog and digital FP-CIMs face several significant challenges in realizing FP calculations, due to difficulties associated with handling high-bit precision: including (1) effectively combining the advantages of analog and digital CIMs while mitigating their respective drawbacks for high-bit-precision processing; (2) achieving optimal design trade-off for an analog-digital converter (ADC) necessitates the simultaneous consideration of bit precision, throughput, and overhead; (3) addressing the need for large fan-in multi-level adder trees in inner-based CIMs to sum high-bit-precision partial products, which can adversely impact overall EF, as shown in Fig. 34.6.1.
AB - SRAM-based computing-in-memory (CIM) is considered crucial to achieving high-energy efficiency (EF) for artificial-intelligence (AI) applications on edge devices. Researchers are currently exploring floating-point (FP) CIM [1], [2], as integer (INT) precision CIMs [3] -[6] are no longer sufficient for new AI applications, which demand increased accuracy, complexity, and on-chip training. However, both analog and digital FP-CIMs face several significant challenges in realizing FP calculations, due to difficulties associated with handling high-bit precision: including (1) effectively combining the advantages of analog and digital CIMs while mitigating their respective drawbacks for high-bit-precision processing; (2) achieving optimal design trade-off for an analog-digital converter (ADC) necessitates the simultaneous consideration of bit precision, throughput, and overhead; (3) addressing the need for large fan-in multi-level adder trees in inner-based CIMs to sum high-bit-precision partial products, which can adversely impact overall EF, as shown in Fig. 34.6.1.
UR - http://www.scopus.com/inward/record.url?scp=85188073944&partnerID=8YFLogxK
U2 - 10.1109/ISSCC49657.2024.10454313
DO - 10.1109/ISSCC49657.2024.10454313
M3 - Conference contribution
AN - SCOPUS:85188073944
T3 - Digest of Technical Papers - IEEE International Solid-State Circuits Conference
SP - 576
EP - 578
BT - 2024 IEEE International Solid-State Circuits Conference, ISSCC 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2024 IEEE International Solid-State Circuits Conference, ISSCC 2024
Y2 - 18 February 2024 through 22 February 2024
ER -