TY - GEN
T1 - (1-x)(K0.475Na0.475Li0.05)(Nb 0.975Sb0.025)O3-xBiFeO3 lead-free piezoelectric ceramics with CuO sintering aid
AU - Zhao, Yongjie
AU - Zhao, Yuzhen
AU - Huang, Rongxia
AU - Liu, Rongzheng
AU - Zhou, Heping
PY - 2011
Y1 - 2011
N2 - (1-x) (K0.475Na0.475Li0.05)(Nb 0.975Sb0.025)O3-xmolBiFeO3 (x=0, 0.002, 0.004, 0.006, 0.008) doped with 0.8mol%CuO lead-free piezoelectric ceramics were prepared by the solid state reaction technique. X-ray diffraction patterns suggested that all the ceramics presented perovskite structure. The compositional dependence of the phase structure and the electrical properties of the ceramics were studied. The ceramic (x=0.002) near room temperature exhibited excellent electrical properties (piezoelectric constant d 33=172pC/N, planar electromechanical coupling factor k p=0.43, and dielectric constant ε33 T/ε0=418). A relatively high mechanical quality factor (Qm=200) was also obtained in this particular composition. All these results revealed that this system might become a promising candidate for lead-free piezoelectric materials.
AB - (1-x) (K0.475Na0.475Li0.05)(Nb 0.975Sb0.025)O3-xmolBiFeO3 (x=0, 0.002, 0.004, 0.006, 0.008) doped with 0.8mol%CuO lead-free piezoelectric ceramics were prepared by the solid state reaction technique. X-ray diffraction patterns suggested that all the ceramics presented perovskite structure. The compositional dependence of the phase structure and the electrical properties of the ceramics were studied. The ceramic (x=0.002) near room temperature exhibited excellent electrical properties (piezoelectric constant d 33=172pC/N, planar electromechanical coupling factor k p=0.43, and dielectric constant ε33 T/ε0=418). A relatively high mechanical quality factor (Qm=200) was also obtained in this particular composition. All these results revealed that this system might become a promising candidate for lead-free piezoelectric materials.
KW - KNN-LN-LS
KW - Lead free
KW - Piezoelectric ceramics
UR - http://www.scopus.com/inward/record.url?scp=79960029601&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/MSF.687.228
DO - 10.4028/www.scientific.net/MSF.687.228
M3 - Conference contribution
AN - SCOPUS:79960029601
SN - 9783037851692
T3 - Materials Science Forum
SP - 228
EP - 232
BT - Functional and Electronic Materials
PB - Trans Tech Publications Ltd.
ER -