基于阵列式传感器侵彻信号采集与计层算法研究

Translated title of the contribution: Research on overload signal acquisition and layer identification algorithm based on array sensor penetration

Dezhi Zheng, Mengtian Qiao, Zhongxiang Li*, Chun Hu, Chengjun Zhang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

The penetration weapons can effectively damage the enemy's underground works and other multi-layer structural targets. To achieve the precise control of the blast point and achieve the best damage effect, the acquisition and identification of the multilayer penetration signal are crucial. In this paper, a penetration simulation experiment method based on array sensor is proposed about several key technologies such as acquisition of penetration signal and layer identification algorithm. The interval of three impact times is controlled to be 9. 15 and 5. 41 ms. Compared with the finite element simulation results, the reliability of the multi-channel signal acquisition circuit and the feasibility of the simulation experiment method are verified. Meanwhile, to improve the accuracy of layer identification, short-time Fourier transform, wavelet transform and Winger-Vile distribution were used to analyze the experimental data at meter layer. The analysis results show that Winger-Vie algorithm can be comprehensively analyzed from multiple dimensions of time, frequency and energy, with high recognition rate and intuitiveness. However, in terms of information extraction, it still needs to improve the time-frequency analysis for optimization. The research of this paper provides an important basis for realizing high-precision penetration signal meter layer and solving signal adhesion problem.

Translated title of the contributionResearch on overload signal acquisition and layer identification algorithm based on array sensor penetration
Original languageChinese (Traditional)
Pages (from-to)221-233
Number of pages13
JournalYi Qi Yi Biao Xue Bao/Chinese Journal of Scientific Instrument
Volume44
Issue number3
DOIs
Publication statusPublished - Mar 2023

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