TY - GEN
T1 - Novel high performance millimeter-wave resonator and filter structures using embedded wafer level packaging (EWLP) technology
AU - Li, Rui
AU - Jung, Boo Yang
AU - Jin, Cheng
AU - Fai, Chang Ka
AU - Ho, Soon Wee
AU - Sorono, Dexter Velez
PY - 2013
Y1 - 2013
N2 - In this paper, a 60 GHz resonator is designed and implemented on embedded wafer level packaging (EWLP) platform. The resonator is constructed in substrate integrated waveguide (SIW) configuration with the molding compound as the filled in substrate material. Through molding vias (TMVs) are employed to realize the via fences and the top and bottom redistribution layers (RDLs) serve as the top and bottom metallic walls. The resonator exhibits a quality factor (Q-factor) of 88. The resonator is subsequently used to form a secondL-order bandpass filter by cascading two such resonators in a line. The insertion loss of the bandpass filter is smaller than 4.15 dB, and the return loss is larger than 12.95 dB. The fractional bandwidth is 3.5% at 59.20Hz.
AB - In this paper, a 60 GHz resonator is designed and implemented on embedded wafer level packaging (EWLP) platform. The resonator is constructed in substrate integrated waveguide (SIW) configuration with the molding compound as the filled in substrate material. Through molding vias (TMVs) are employed to realize the via fences and the top and bottom redistribution layers (RDLs) serve as the top and bottom metallic walls. The resonator exhibits a quality factor (Q-factor) of 88. The resonator is subsequently used to form a secondL-order bandpass filter by cascading two such resonators in a line. The insertion loss of the bandpass filter is smaller than 4.15 dB, and the return loss is larger than 12.95 dB. The fractional bandwidth is 3.5% at 59.20Hz.
KW - Bandpass filter (BPF)
KW - embedded wafer level packaging (EWLP)
KW - millimetre-wave (mm-wave)
KW - resonator
KW - substrate integrated waveguide (SIW)
KW - through molding via (TMV)
UR - http://www.scopus.com/inward/record.url?scp=84897819024&partnerID=8YFLogxK
U2 - 10.1109/EPTC.2013.6745841
DO - 10.1109/EPTC.2013.6745841
M3 - Conference contribution
AN - SCOPUS:84897819024
SN - 9781479928330
T3 - Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013
SP - 844
EP - 847
BT - Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013
T2 - 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013
Y2 - 11 December 2013 through 13 December 2013
ER -