Thermal microscope imaging system for semiconductor device and IC invalidation analysis

Meijing Gao*, Weiqi Jin, Yinan Chen, Xia Wang

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

9 Citations (Scopus)

Abstract

In order to analyze the invalidation of the Semiconductor Device and IC, we proposed a novel digital thermal microscope based on the uncooled focal plane detector. We give the operating principle, system's construction and the mathematical mode of noise equivalent temperature difference (NETD). Based on the mathematical model, some measures were taken to increase the system temperature resolution. Furthermore we proposed an adaptive nonuniformity correction algorithm for the UFPA. The software for the thermal microscope is provided based on Visual C++. Results of real thermal image experiments have shown that the digital thermal microscope is designed successfully and achieves good performance. Thus it will become an effective means for invalidation Analysis. This method is a novel and unique contribution to field of semiconductor device and IC invalidation analysis.

Original languageEnglish
Title of host publicationInternational Symposium on Photoelectronic Detection and Imaging 2007
Subtitle of host publicationPhotoelectronic Imaging and Detection
DOIs
Publication statusPublished - 2008
EventInternational Symposium on Photoelectronic Detection and Imaging, ISPDI 2007: Photoelectronic Imaging and Detection - Beijing, China
Duration: 9 Sept 200712 Sept 2007

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume6621
ISSN (Print)0277-786X

Conference

ConferenceInternational Symposium on Photoelectronic Detection and Imaging, ISPDI 2007: Photoelectronic Imaging and Detection
Country/TerritoryChina
CityBeijing
Period9/09/0712/09/07

Keywords

  • Digital thermal microscope
  • Invalidation analysis
  • Uncooled focal plane detector

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