The Kapitza resistance across grain boundary by molecular dynamics simulation

Qiheng Tang*, Yugui Yao

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

5 Citations (Scopus)

Abstract

Nonequilibrium molecular dynamics (NEMD) simulations are performed to calculate thermal boundary resistance that arises from heat flow across Si grain boundary. The environment-dependent interatomic potential (EDIP) on crystal silicon is adopted as a model system. The issues are related to nonlinear response, local thermal equilibrium, and statistical averaging. The tilt grain boundaries 5 and 13 are simulated, and the values of thermal boundary resistance by nonequilibrium molecular dynamics are compared with those by Maiti et al. (Solid State Communications, vol. 102, 1997). Using the disperse relation of EDIP potential, an average transmission coefficient of thermal conductivity across boundary is calculated.

Original languageEnglish
Pages (from-to)387-398
Number of pages12
JournalNanoscale and Microscale Thermophysical Engineering
Volume10
Issue number4
DOIs
Publication statusPublished - 1 Dec 2006
Externally publishedYes

Keywords

  • Grain boundaries
  • Nonequilibrium molecular dynamics
  • Phonons
  • The Kapitza resistance
  • Thermal conduction

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