Study on the mechanical behavior of adhesive interface by digital image correlation

Bao Qiao Guo; Hui Min Xie; Jian Guo Zhu; Huai Xi Wang; Peng Wan Chen; Qing Ming Zhang

doi:10.1007/s11433-011-4273-5

Study on the mechanical behavior of adhesive interface by digital image correlation

Bao Qiao Guo, Hui Min Xie^*, Jian Guo Zhu, Huai Xi Wang, Peng Wan Chen, Qing Ming Zhang

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

14 Citations (Scopus)

Abstract

The shear modulus of the adhesive layer and the failure mode of adhesive structure on single lap joint specimens under tensile tests are investigated in this paper. The aluminum-aluminum adherends are bonded by two different adhesives: polydimethylsiloxane (PDMS) and epoxy. The full deformation fields are measured using the digital image correlation (DIC) method with the images on the middle part of the adhesive layer recorded by a high resolution microscope. Then, the shear modulus values of the two adhesives are calculated with a simple pure shear strain model. A numerical model is proposed to simulate the single lap joint structure under tensile load in comparison with the experimental results. The results show that this method can successfully estimate the shear modulus of the adhesive layer. The failure behavior of epoxy adhesive/adherend interface is also analyzed and discussed.

Original language	English
Pages (from-to)	574-580
Number of pages	7
Journal	Science China: Physics, Mechanics and Astronomy
Volume	54
Issue number	4
DOIs	https://doi.org/10.1007/s11433-011-4273-5
Publication status	Published - Apr 2011

Keywords

adhesive interface
digital image correlation
failure
shear modulus
single lap joint

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10.1007/s11433-011-4273-5

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title = "Study on the mechanical behavior of adhesive interface by digital image correlation",

abstract = "The shear modulus of the adhesive layer and the failure mode of adhesive structure on single lap joint specimens under tensile tests are investigated in this paper. The aluminum-aluminum adherends are bonded by two different adhesives: polydimethylsiloxane (PDMS) and epoxy. The full deformation fields are measured using the digital image correlation (DIC) method with the images on the middle part of the adhesive layer recorded by a high resolution microscope. Then, the shear modulus values of the two adhesives are calculated with a simple pure shear strain model. A numerical model is proposed to simulate the single lap joint structure under tensile load in comparison with the experimental results. The results show that this method can successfully estimate the shear modulus of the adhesive layer. The failure behavior of epoxy adhesive/adherend interface is also analyzed and discussed.",

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AU - Guo, Bao Qiao

AU - Xie, Hui Min

AU - Zhu, Jian Guo

AU - Wang, Huai Xi

AU - Chen, Peng Wan

AU - Zhang, Qing Ming

PY - 2011/4

Y1 - 2011/4

N2 - The shear modulus of the adhesive layer and the failure mode of adhesive structure on single lap joint specimens under tensile tests are investigated in this paper. The aluminum-aluminum adherends are bonded by two different adhesives: polydimethylsiloxane (PDMS) and epoxy. The full deformation fields are measured using the digital image correlation (DIC) method with the images on the middle part of the adhesive layer recorded by a high resolution microscope. Then, the shear modulus values of the two adhesives are calculated with a simple pure shear strain model. A numerical model is proposed to simulate the single lap joint structure under tensile load in comparison with the experimental results. The results show that this method can successfully estimate the shear modulus of the adhesive layer. The failure behavior of epoxy adhesive/adherend interface is also analyzed and discussed.

AB - The shear modulus of the adhesive layer and the failure mode of adhesive structure on single lap joint specimens under tensile tests are investigated in this paper. The aluminum-aluminum adherends are bonded by two different adhesives: polydimethylsiloxane (PDMS) and epoxy. The full deformation fields are measured using the digital image correlation (DIC) method with the images on the middle part of the adhesive layer recorded by a high resolution microscope. Then, the shear modulus values of the two adhesives are calculated with a simple pure shear strain model. A numerical model is proposed to simulate the single lap joint structure under tensile load in comparison with the experimental results. The results show that this method can successfully estimate the shear modulus of the adhesive layer. The failure behavior of epoxy adhesive/adherend interface is also analyzed and discussed.

KW - adhesive interface

KW - digital image correlation

KW - failure

KW - shear modulus

KW - single lap joint

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JF - Science China: Physics, Mechanics and Astronomy

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Study on the mechanical behavior of adhesive interface by digital image correlation

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