Structure design for heat sink based on thermal analysis

Hai Gang Sun*, Yong Zhou

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Citation (Scopus)

Abstract

Thermal design and the working temperature control have been a key factor in the design of electronic devices and system. In this paper, a sort of heat sink collocated with high-power IGBT module, which is commonly used in car-carrying motor control system, is designed based on thermal analysis by means of CFD simulation and computer-aided analyzing, also the influence relations of structure parameters with thermal performance are studied. With thermal control as the overall design objective, structure parameters of heat sink are determined according to the obtained relations. Further, thermal performance of the designed heat sink is simulated and analyzed in CFD software to examine the validity of the design result. In this way, a method of thermal analyzing and structure parameter design for heat sink, which is proved as an efficacious approach, is introduced and can be used to thermal design and analysis for similar products.

Original languageEnglish
Title of host publicationInformation Engineering for Mechanics and Materials
Pages767-773
Number of pages7
DOIs
Publication statusPublished - 2011
Event2011 International Conference on Information Engineering for Mechanics and Materials, ICIMM 2011 - Shanghai, China
Duration: 13 Aug 201114 Aug 2011

Publication series

NameApplied Mechanics and Materials
Volume80-81
ISSN (Print)1660-9336
ISSN (Electronic)1662-7482

Conference

Conference2011 International Conference on Information Engineering for Mechanics and Materials, ICIMM 2011
Country/TerritoryChina
CityShanghai
Period13/08/1114/08/11

Keywords

  • Heat sink
  • Structure design
  • Thermal analysis
  • Thermal design

Fingerprint

Dive into the research topics of 'Structure design for heat sink based on thermal analysis'. Together they form a unique fingerprint.

Cite this