TY - GEN
T1 - Structure design for heat sink based on thermal analysis
AU - Sun, Hai Gang
AU - Zhou, Yong
PY - 2011
Y1 - 2011
N2 - Thermal design and the working temperature control have been a key factor in the design of electronic devices and system. In this paper, a sort of heat sink collocated with high-power IGBT module, which is commonly used in car-carrying motor control system, is designed based on thermal analysis by means of CFD simulation and computer-aided analyzing, also the influence relations of structure parameters with thermal performance are studied. With thermal control as the overall design objective, structure parameters of heat sink are determined according to the obtained relations. Further, thermal performance of the designed heat sink is simulated and analyzed in CFD software to examine the validity of the design result. In this way, a method of thermal analyzing and structure parameter design for heat sink, which is proved as an efficacious approach, is introduced and can be used to thermal design and analysis for similar products.
AB - Thermal design and the working temperature control have been a key factor in the design of electronic devices and system. In this paper, a sort of heat sink collocated with high-power IGBT module, which is commonly used in car-carrying motor control system, is designed based on thermal analysis by means of CFD simulation and computer-aided analyzing, also the influence relations of structure parameters with thermal performance are studied. With thermal control as the overall design objective, structure parameters of heat sink are determined according to the obtained relations. Further, thermal performance of the designed heat sink is simulated and analyzed in CFD software to examine the validity of the design result. In this way, a method of thermal analyzing and structure parameter design for heat sink, which is proved as an efficacious approach, is introduced and can be used to thermal design and analysis for similar products.
KW - Heat sink
KW - Structure design
KW - Thermal analysis
KW - Thermal design
UR - http://www.scopus.com/inward/record.url?scp=80052102119&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/AMM.80-81.767
DO - 10.4028/www.scientific.net/AMM.80-81.767
M3 - Conference contribution
AN - SCOPUS:80052102119
SN - 9783037852125
T3 - Applied Mechanics and Materials
SP - 767
EP - 773
BT - Information Engineering for Mechanics and Materials
T2 - 2011 International Conference on Information Engineering for Mechanics and Materials, ICIMM 2011
Y2 - 13 August 2011 through 14 August 2011
ER -