Stiffness-Tunable Microstructures Based on Electrothermal Bimorph Beams

Lei Xiao, Yingtao Ding, Peng Wang, Hengzhang Yang, Huikai Xie

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Robust and light-weighted microstructures are highly desired for various MEMS devices. Thin-film structures are light-weighted, but often suffer from low stiffness. In this abstract, a microstructure with tunable and enhanced stiffness is proposed for the first time. The stiffness-tunable microstructure is based on an electrothermal bimorph beam with an arched transverse cross-section. The concept, exemplified structure design and fabrication method of the proposed structure are presented. Both simulation and test results show that the stiffness of such a structure can be continuously changed more than 25 times by tuning the applied voltage from 0 to 7 V. This method provides a simple approach to stiffen thin-film microstructures.

Original languageEnglish
Title of host publication34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages79-82
Number of pages4
ISBN (Electronic)9781665419123
DOIs
Publication statusPublished - 25 Jan 2021
Event34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021 - Virtual, Gainesville, United States
Duration: 25 Jan 202129 Jan 2021

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume2021-January
ISSN (Print)1084-6999

Conference

Conference34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021
Country/TerritoryUnited States
CityVirtual, Gainesville
Period25/01/2129/01/21

Keywords

  • Thin-film beam
  • electrothermal bimorph
  • stiffness enhancement
  • tunable stiffness

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