Abstract
A shear stress sensor based on heat transfer principle has been developed in a micro channel A silicon wafer with micro channels and a pyrex glass with hot films have been bonded to form this sensor. The temperature coefficient of resistance is measured and over heat ratios with various input powers are determined. Square waves are superimposed on a constant bias current to determine the time constants under diversiform over heat ratios. Calibration has been conducted and shear stresses versus pressure difference have been tested.
| Original language | English |
|---|---|
| Pages (from-to) | 713-716 |
| Number of pages | 4 |
| Journal | Chinese Journal of Sensors and Actuators |
| Volume | 18 |
| Issue number | 4 |
| Publication status | Published - Dec 2005 |
| Externally published | Yes |
Keywords
- Micro-channel
- Sensor
- Shear stress