TY - JOUR
T1 - Resist Thermal Shock Through Viscoelastic Interface Encapsulation in Perovskite Solar Cells
AU - Ma, Sai
AU - Tang, Jiahong
AU - Yuan, Guizhou
AU - Zhang, Ying
AU - Wang, Yan
AU - Wu, Yuetong
AU - Zhu, Cheng
AU - Wang, Yimiao
AU - Wu, Shengfang
AU - Lu, Yue
AU - Chi, Shumeng
AU - Song, Tinglu
AU - Zhou, Huanping
AU - Sui, Manling
AU - Li, Yujing
AU - Chen, Qi
N1 - Publisher Copyright:
© 2024 The Authors. Energy & Environmental Materials published by John Wiley & Sons Australia, Ltd on behalf of Zhengzhou University.
PY - 2024
Y1 - 2024
N2 - Enhancing the lifetime of perovskite solar cells (PSCs) is one of the essential challenges for their industrialization. Although the external encapsulation protects the perovskite device from the erosion of moisture and oxygen under various harsh conditions. However, the perovskite devices still undergo static and dynamic thermal stress during thermal and thermal cycling aging, respectively, resulting in irreversible damage to the morphology, component, and phase of stacked materials. Herein, the viscoelastic polymer polyvinyl butyral (PVB) material is designed onto the surface of perovskite films to form flexible interface encapsulation. After PVB interface encapsulation, the surface modulus of perovskite films decreases by nearly 50%, and the interface stress range under the dynamic temperature field (−40 to 85 °C) drops from −42.5 to 64.8 MPa to −14.8 to 5.0 MPa. Besides, PVB forms chemical interactions with FA+ cations and Pb2+, and the macroscopic residual stress is regulated and defects are reduced of the PVB encapsulated perovskite film. As a result, the optimized device's efficiency increases from 22.21% to 23.11%. Additionally, after 1500 h of thermal treatment (85 °C), 1000 h of damp heat test (85 °C & 85% RH), and 250 cycles of thermal cycling test (−40 to 85 °C), the devices maintain 92.6%, 85.8%, and 96.1% of their initial efficiencies, respectively.
AB - Enhancing the lifetime of perovskite solar cells (PSCs) is one of the essential challenges for their industrialization. Although the external encapsulation protects the perovskite device from the erosion of moisture and oxygen under various harsh conditions. However, the perovskite devices still undergo static and dynamic thermal stress during thermal and thermal cycling aging, respectively, resulting in irreversible damage to the morphology, component, and phase of stacked materials. Herein, the viscoelastic polymer polyvinyl butyral (PVB) material is designed onto the surface of perovskite films to form flexible interface encapsulation. After PVB interface encapsulation, the surface modulus of perovskite films decreases by nearly 50%, and the interface stress range under the dynamic temperature field (−40 to 85 °C) drops from −42.5 to 64.8 MPa to −14.8 to 5.0 MPa. Besides, PVB forms chemical interactions with FA+ cations and Pb2+, and the macroscopic residual stress is regulated and defects are reduced of the PVB encapsulated perovskite film. As a result, the optimized device's efficiency increases from 22.21% to 23.11%. Additionally, after 1500 h of thermal treatment (85 °C), 1000 h of damp heat test (85 °C & 85% RH), and 250 cycles of thermal cycling test (−40 to 85 °C), the devices maintain 92.6%, 85.8%, and 96.1% of their initial efficiencies, respectively.
KW - device stability
KW - perovskite solar cells
KW - stress field
KW - surface modulus
KW - thermal shock
UR - http://www.scopus.com/inward/record.url?scp=85192797630&partnerID=8YFLogxK
U2 - 10.1002/eem2.12739
DO - 10.1002/eem2.12739
M3 - Article
AN - SCOPUS:85192797630
SN - 2575-0348
JO - Energy and Environmental Materials
JF - Energy and Environmental Materials
ER -