TY - JOUR
T1 - Prediction of the intrinsic thermal conductivity of phonons in dielectric and semiconductor materials based on the density of the lattice vibration energy
AU - Qunbo, Fan
AU - Feng, Zhang
AU - Fuchi, Wang
AU - Huiling, Zhang
PY - 2008/9
Y1 - 2008/9
N2 - A novel method is proposed to simulate the intrinsic thermal conductivity of the phonons in dielectric and semiconductor materials by introducing the concept of the density of the lattice vibration energy, which is a function of frequency and temperature. A quantitative relationship between the density of the lattice vibration energy and the mean free path of the phonons is established. The heat capacity and sound velocity can also be calculated by using the phonon density of states, the theoretical densities, and the elastic modulus. The thermal conductivities of some typical dielectric and semiconductor materials are then calculated, and it is found that the agreement with experimental data is good for some materials. In contrast to traditional semi-empirical methods, there is no need to input any experimental data.
AB - A novel method is proposed to simulate the intrinsic thermal conductivity of the phonons in dielectric and semiconductor materials by introducing the concept of the density of the lattice vibration energy, which is a function of frequency and temperature. A quantitative relationship between the density of the lattice vibration energy and the mean free path of the phonons is established. The heat capacity and sound velocity can also be calculated by using the phonon density of states, the theoretical densities, and the elastic modulus. The thermal conductivities of some typical dielectric and semiconductor materials are then calculated, and it is found that the agreement with experimental data is good for some materials. In contrast to traditional semi-empirical methods, there is no need to input any experimental data.
KW - Density of lattice vibration energy
KW - Mean free path of phonons
KW - Thermal conductivity of phonons
UR - http://www.scopus.com/inward/record.url?scp=56749180572&partnerID=8YFLogxK
U2 - 10.1080/08927020802101718
DO - 10.1080/08927020802101718
M3 - Article
AN - SCOPUS:56749180572
SN - 0892-7022
VL - 34
SP - 1129
EP - 1132
JO - Molecular Simulation
JF - Molecular Simulation
IS - 10-15
ER -