Novel high performance millimeter-wave resonator and filter structures using embedded wafer level packaging (EWLP) technology

Rui Li; Boo Yang Jung; Cheng Jin; Chang Ka Fai; Soon Wee Ho; Dexter Velez Sorono

doi:10.1109/EPTC.2013.6745841

Novel high performance millimeter-wave resonator and filter structures using embedded wafer level packaging (EWLP) technology

Rui Li, Boo Yang Jung, Cheng Jin, Chang Ka Fai, Soon Wee Ho, Dexter Velez Sorono

Agency for Science, Technology and Research, Singapore

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

In this paper, a 60 GHz resonator is designed and implemented on embedded wafer level packaging (EWLP) platform. The resonator is constructed in substrate integrated waveguide (SIW) configuration with the molding compound as the filled in substrate material. Through molding vias (TMVs) are employed to realize the via fences and the top and bottom redistribution layers (RDLs) serve as the top and bottom metallic walls. The resonator exhibits a quality factor (Q-factor) of 88. The resonator is subsequently used to form a secondL-order bandpass filter by cascading two such resonators in a line. The insertion loss of the bandpass filter is smaller than 4.15 dB, and the return loss is larger than 12.95 dB. The fractional bandwidth is 3.5% at 59.20Hz.

Original language	English
Title of host publication	Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013
Pages	844-847
Number of pages	4
DOIs	https://doi.org/10.1109/EPTC.2013.6745841
Publication status	Published - 2013
Externally published	Yes
Event	2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013 - Singapore, Singapore Duration: 11 Dec 2013 → 13 Dec 2013

Publication series

Name	Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013

Conference

Conference	2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013
Country/Territory	Singapore
City	Singapore
Period	11/12/13 → 13/12/13

Keywords

Bandpass filter (BPF)
embedded wafer level packaging (EWLP)
millimetre-wave (mm-wave)
resonator
substrate integrated waveguide (SIW)
through molding via (TMV)

Access to Document

10.1109/EPTC.2013.6745841

Cite this

Li, R., Jung, B. Y., Jin, C., Fai, C. K., Ho, S. W., & Sorono, D. V. (2013). Novel high performance millimeter-wave resonator and filter structures using embedded wafer level packaging (EWLP) technology. In Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013 (pp. 844-847). Article 6745841 (Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013). https://doi.org/10.1109/EPTC.2013.6745841

Li, Rui ; Jung, Boo Yang ; Jin, Cheng et al. / Novel high performance millimeter-wave resonator and filter structures using embedded wafer level packaging (EWLP) technology. Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013. 2013. pp. 844-847 (Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013).

@inproceedings{f925536604f14f9298d0227247de4c0a,

title = "Novel high performance millimeter-wave resonator and filter structures using embedded wafer level packaging (EWLP) technology",

abstract = "In this paper, a 60 GHz resonator is designed and implemented on embedded wafer level packaging (EWLP) platform. The resonator is constructed in substrate integrated waveguide (SIW) configuration with the molding compound as the filled in substrate material. Through molding vias (TMVs) are employed to realize the via fences and the top and bottom redistribution layers (RDLs) serve as the top and bottom metallic walls. The resonator exhibits a quality factor (Q-factor) of 88. The resonator is subsequently used to form a secondL-order bandpass filter by cascading two such resonators in a line. The insertion loss of the bandpass filter is smaller than 4.15 dB, and the return loss is larger than 12.95 dB. The fractional bandwidth is 3.5% at 59.20Hz.",

keywords = "Bandpass filter (BPF), embedded wafer level packaging (EWLP), millimetre-wave (mm-wave), resonator, substrate integrated waveguide (SIW), through molding via (TMV)",

author = "Rui Li and Jung, {Boo Yang} and Cheng Jin and Fai, {Chang Ka} and Ho, {Soon Wee} and Sorono, {Dexter Velez}",

year = "2013",

doi = "10.1109/EPTC.2013.6745841",

language = "English",

isbn = "9781479928330",

series = "Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013",

pages = "844--847",

booktitle = "Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013",

note = "2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013 ; Conference date: 11-12-2013 Through 13-12-2013",

}

Li, R, Jung, BY, Jin, C, Fai, CK, Ho, SW & Sorono, DV 2013, Novel high performance millimeter-wave resonator and filter structures using embedded wafer level packaging (EWLP) technology. in Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013., 6745841, Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013, pp. 844-847, 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013, Singapore, Singapore, 11/12/13. https://doi.org/10.1109/EPTC.2013.6745841

Novel high performance millimeter-wave resonator and filter structures using embedded wafer level packaging (EWLP) technology. / Li, Rui; Jung, Boo Yang; Jin, Cheng et al.
Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013. 2013. p. 844-847 6745841 (Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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T1 - Novel high performance millimeter-wave resonator and filter structures using embedded wafer level packaging (EWLP) technology

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AU - Ho, Soon Wee

AU - Sorono, Dexter Velez

PY - 2013

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N2 - In this paper, a 60 GHz resonator is designed and implemented on embedded wafer level packaging (EWLP) platform. The resonator is constructed in substrate integrated waveguide (SIW) configuration with the molding compound as the filled in substrate material. Through molding vias (TMVs) are employed to realize the via fences and the top and bottom redistribution layers (RDLs) serve as the top and bottom metallic walls. The resonator exhibits a quality factor (Q-factor) of 88. The resonator is subsequently used to form a secondL-order bandpass filter by cascading two such resonators in a line. The insertion loss of the bandpass filter is smaller than 4.15 dB, and the return loss is larger than 12.95 dB. The fractional bandwidth is 3.5% at 59.20Hz.

AB - In this paper, a 60 GHz resonator is designed and implemented on embedded wafer level packaging (EWLP) platform. The resonator is constructed in substrate integrated waveguide (SIW) configuration with the molding compound as the filled in substrate material. Through molding vias (TMVs) are employed to realize the via fences and the top and bottom redistribution layers (RDLs) serve as the top and bottom metallic walls. The resonator exhibits a quality factor (Q-factor) of 88. The resonator is subsequently used to form a secondL-order bandpass filter by cascading two such resonators in a line. The insertion loss of the bandpass filter is smaller than 4.15 dB, and the return loss is larger than 12.95 dB. The fractional bandwidth is 3.5% at 59.20Hz.

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Li R, Jung BY, Jin C, Fai CK, Ho SW, Sorono DV. Novel high performance millimeter-wave resonator and filter structures using embedded wafer level packaging (EWLP) technology. In Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013. 2013. p. 844-847. 6745841. (Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013). doi: 10.1109/EPTC.2013.6745841

Novel high performance millimeter-wave resonator and filter structures using embedded wafer level packaging (EWLP) technology

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Keywords

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