MPM simulations of high-speed machining of Ti6Al4V titanium alloy considering dynamic recrystallization phenomenon and thermal conductivity

X. Y. Gu, C. Y. Dong*, T. Cheng

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

20 Citations (Scopus)

Abstract

Ti6Al4V titanium alloy is often used in the aircraft industry due to its good strength and toughness etc. However, it is very difficult to simulate high speed machining of titanium alloy using the finite element method (FEM). The reason is that the high speed, large deformation and high strain rate of metal material at high temperature etc. will lead to the element distortions and other numerical difficulties. In contrast with FEM, material point method (MPM) has the advantage of simulating extreme large deformation, fracture and impact problems. Therefore, it is specially suitable for dealing with high speed cutting process. In many existing researches about the high speed cutting process using Johnson−Cook constitutive model, the material dynamic recrystallization softening effect under high pressure and high temperature has not been considered. For this, three modified Johnson−Cook constitutive models for Ti6Al4V titanium alloy are adopted and the parameters for these models were obtained by the split Hopkinson pressure bar (SHPB) test considering the critical strain values, high-temperature range and dynamic recrystallization phenomenon. Furthermore, to ensure the numerical accuracy, the transient heat conduction algorithm is employed in MPM implementation. Finally, comparison and discussion are carried out between the experimental and the simulation data, which show that the high speed cutting process can be better simulated using the modified Johnson−Cook constitutive models.

Original languageEnglish
Pages (from-to)517-538
Number of pages22
JournalApplied Mathematical Modelling
Volume56
DOIs
Publication statusPublished - Apr 2018

Keywords

  • Dynamic recrystallization
  • High speed cutting
  • Material point method
  • Thermal conductivity

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