Modulating void action and residual stress variation of composite materials during curing process

Rong Guo Wang*, Qiu Tian, Wen You Ma, Cheng Qin Dai, Feng Tian, Yu Jin Chen, Chen Sha Li, Mao Sheng Cao

*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

4 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Modulating void action and residual stress variation of composite materials during curing process'. Together they form a unique fingerprint.

Material Science

Engineering