Micromechanical simulation of the damage and fracture behavior of a highly particle-filled composite material using manifold method

Haoju Huai; Pengwan Chen; Kaida Dai

doi:10.3850/9789810844554-0121

Micromechanical simulation of the damage and fracture behavior of a highly particle-filled composite material using manifold method

Haoju Huai, Pengwan Chen^*, Kaida Dai

^*Corresponding author for this work

Beijing Institute of Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Citation (Scopus)

Original language	English
Title of host publication	Analysis of Discontinuous Deformation
Subtitle of host publication	New Developments and Applications
Pages	211-216
Number of pages	6
DOIs	https://doi.org/10.3850/9789810844554-0121
Publication status	Published - 2010
Event	9th International Conference on Analysis of Discontinuous Deformation, ICADD - Singapore, Singapore Duration: 25 Nov 2009 → 27 Nov 2009

Publication series

Name	Analysis of Discontinuous Deformation: New Developments and Applications

Conference

Conference	9th International Conference on Analysis of Discontinuous Deformation, ICADD
Country/Territory	Singapore
City	Singapore
Period	25/11/09 → 27/11/09

Access to Document

10.3850/9789810844554-0121

Cite this

Huai, H., Chen, P., & Dai, K. (2010). Micromechanical simulation of the damage and fracture behavior of a highly particle-filled composite material using manifold method. In Analysis of Discontinuous Deformation: New Developments and Applications (pp. 211-216). (Analysis of Discontinuous Deformation: New Developments and Applications). https://doi.org/10.3850/9789810844554-0121

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title = "Micromechanical simulation of the damage and fracture behavior of a highly particle-filled composite material using manifold method",

author = "Haoju Huai and Pengwan Chen and Kaida Dai",

year = "2010",

doi = "10.3850/9789810844554-0121",

language = "English",

isbn = "9789810844554",

series = "Analysis of Discontinuous Deformation: New Developments and Applications",

pages = "211--216",

booktitle = "Analysis of Discontinuous Deformation",

note = "9th International Conference on Analysis of Discontinuous Deformation, ICADD ; Conference date: 25-11-2009 Through 27-11-2009",

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Huai, H, Chen, P & Dai, K 2010, Micromechanical simulation of the damage and fracture behavior of a highly particle-filled composite material using manifold method. in Analysis of Discontinuous Deformation: New Developments and Applications. Analysis of Discontinuous Deformation: New Developments and Applications, pp. 211-216, 9th International Conference on Analysis of Discontinuous Deformation, ICADD, Singapore, Singapore, 25/11/09. https://doi.org/10.3850/9789810844554-0121

Micromechanical simulation of the damage and fracture behavior of a highly particle-filled composite material using manifold method. / Huai, Haoju; Chen, Pengwan ; Dai, Kaida.
Analysis of Discontinuous Deformation: New Developments and Applications. 2010. p. 211-216 (Analysis of Discontinuous Deformation: New Developments and Applications).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Micromechanical simulation of the damage and fracture behavior of a highly particle-filled composite material using manifold method

AU - Huai, Haoju

AU - Chen, Pengwan

AU - Dai, Kaida

PY - 2010

Y1 - 2010

UR - http://www.scopus.com/inward/record.url?scp=78149315618&partnerID=8YFLogxK

U2 - 10.3850/9789810844554-0121

DO - 10.3850/9789810844554-0121

M3 - Conference contribution

AN - SCOPUS:78149315618

SN - 9789810844554

T3 - Analysis of Discontinuous Deformation: New Developments and Applications

SP - 211

EP - 216

BT - Analysis of Discontinuous Deformation

T2 - 9th International Conference on Analysis of Discontinuous Deformation, ICADD

Y2 - 25 November 2009 through 27 November 2009

ER -

Micromechanical simulation of the damage and fracture behavior of a highly particle-filled composite material using manifold method

Publication series

Conference

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