Mechanical analysis of adhesion between wearable electronics and human skin based on crack theory of bi-material interface

Yutong Fu, Heng Yang*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

5 Citations (Scopus)

Abstract

In recent years, wearable electronics have been gradually applied in the measurement of human health signals with the development of the technology and the increasing attention to health. The application of the electronic device requires it to be attached to the human skin for an extended period of time. Therefore, it is of great significance to define and judge the comfort of flexible electronic devices. This paper focuses on the adhesion between wearable electronics and human skin based on crack theory of bi-material interface. The comfort of the skin is judged by the magnitude and gradient of the stresses, based on the working principle of human tactile receptors. For the comfort design of wearable electronics, the effects of mechanical and geometric parameters for devices on the skin surface stresses are also discussed. This article provides the theoretical basis for improving the comfort of wearable electronic devices.

Original languageEnglish
Article number111850
JournalInternational Journal of Solids and Structures
Volume254-255
DOIs
Publication statusPublished - 1 Nov 2022

Keywords

  • Adhesion
  • Bi-material interfacial crack
  • Mechanical analysis
  • Residual stresses
  • Wearable flexible electronics

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