@inproceedings{d9707b5ad6314ac99fdada0a15cdf573,
title = "Intermittent Fault of Solder Joints: A Review",
abstract = "Intermittent fault caused by solder joints is an important type of intermittent faults. This paper introduces the internal and external inducements of intermittent fault of solder joints, the reproduction technology of intermittent fault, summarizes the diagnosis methods of intermittent fault and research status at home and abroad, and focuses on the diagnosis methods of intermittent fault of solder joints of three packaging modes.",
keywords = "fault diagnosis, intermittent fault, reproduction technology, solder joints",
author = "Gen Liu and Shulin Liu and Yueze Wang and Zijian Zhang and Xiaojian Yi",
note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 4th International Conference on System Reliability and Safety Engineering, SRSE 2022 ; Conference date: 15-12-2022 Through 18-12-2022",
year = "2022",
doi = "10.1109/SRSE56746.2022.10067378",
language = "English",
series = "2022 4th International Conference on System Reliability and Safety Engineering, SRSE 2022",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "199--206",
booktitle = "2022 4th International Conference on System Reliability and Safety Engineering, SRSE 2022",
address = "United States",
}