Improvement of microstructure and tensile properties of Sn–Bi–Ag alloy by heterogeneous nucleation of β-Sn on Ag3Sn

Tianqi Yang, Xiuchen Zhao*, Zishan Xiong, Wei Tan, Yuhang Wei, Chengwen Tan, Xiaodong Yu, Yingchun Wang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

29 Citations (Scopus)

Abstract

Different weight fractions (0, 0.5, 1.0, 2.0, and 3.0 wt%) of sliver (Ag) were used to dope Sn–Bi eutectic alloys in this study. The microstructure and tensile and thermal properties of Sn–Bi eutectic alloys doped with Ag were investigated. The results indicate that the addition of Ag increases the solidification temperature and reduces the fusing latent heat of alloy, but it has no significant effect on the melting point of the alloy. According to the electron backscattered diffraction (EBSD) analysis and calculation of the disregistry between ε-Ag3Sn and β-Sn, ε-Ag3Sn can be used as the heterogeneous nucleation substrate of β-Sn, thus refining lamellar eutectic spacing. The orientation relationship between the ε-Ag3Sn phase and the β-Sn phase was as follows: [ 0 2‾1 ]Ag3Sn//[ 0 1 2 ]β-Sn, (0 1 2)Ag3Sn//(‾1 2‾1) β-Sn, and [‾1 2 0 ]Ag3Sn//[ 0 1 2 ]β-Sn, (2 1‾1)Ag3Sn//(‾1 2‾1)β-Sn. The tensile strength of the eutectic Sn–Bi alloy with addition of 1.0 wt% Ag reached 72 MPa, which was 20% higher than that of the original alloy.

Original languageEnglish
Article number139372
JournalMaterials Science and Engineering: A
Volume785
DOIs
Publication statusPublished - 21 May 2020

Keywords

  • Fracture mechanics
  • Intermetallic
  • Microstructure
  • Sn-Bi-Ag alloy

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