High impact-induced failure of a novel solid MEMS switch

Wang Ying; Wenzhong Lou; Zhao Yue; Fufu Wang

doi:10.1109/NEMS.2013.6559838

High impact-induced failure of a novel solid MEMS switch

Wang Ying^*, Wenzhong Lou, Zhao Yue, Fufu Wang

^*Corresponding author for this work

School of Mechatronical Engineering

Beijing Institute of Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

3 Citations (Scopus)

Abstract

Due to the rapidly growing MEMS initiator market and the needs for smaller, safer and higher integration, more advanced switches are in demand. The novel solid MEMS switch can improve the security and reliability of MEMS initiator, while the leads of its package are weak under high impact. This paper mainly studied the leads reliability of the novel solid MEMS switch under high impact by FEM simulation analysis. Through simulation analysis, the mainly weakness and the potential failure modes of the leads under high impact can be obtained, which can provide theory reference for the design and application of the novel solid MEMS switch.

Original language	English
Title of host publication	8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013
Pages	755-758
Number of pages	4
DOIs	https://doi.org/10.1109/NEMS.2013.6559838
Publication status	Published - 2013
Event	8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013 - Suzhou, China Duration: 7 Apr 2013 → 10 Apr 2013

Publication series

Name	8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013

Conference

Conference	8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013
Country/Territory	China
City	Suzhou
Period	7/04/13 → 10/04/13

Keywords

high impact
leads
reliability
simulation
the novel solid MEMS switch

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10.1109/NEMS.2013.6559838

Cite this

Ying, W., Lou, W., Yue, Z., & Wang, F. (2013). High impact-induced failure of a novel solid MEMS switch. In 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013 (pp. 755-758). Article 6559838 (8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013). https://doi.org/10.1109/NEMS.2013.6559838

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title = "High impact-induced failure of a novel solid MEMS switch",

abstract = "Due to the rapidly growing MEMS initiator market and the needs for smaller, safer and higher integration, more advanced switches are in demand. The novel solid MEMS switch can improve the security and reliability of MEMS initiator, while the leads of its package are weak under high impact. This paper mainly studied the leads reliability of the novel solid MEMS switch under high impact by FEM simulation analysis. Through simulation analysis, the mainly weakness and the potential failure modes of the leads under high impact can be obtained, which can provide theory reference for the design and application of the novel solid MEMS switch.",

keywords = "high impact, leads, reliability, simulation, the novel solid MEMS switch",

author = "Wang Ying and Wenzhong Lou and Zhao Yue and Fufu Wang",

year = "2013",

doi = "10.1109/NEMS.2013.6559838",

language = "English",

isbn = "9781467363525",

series = "8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013",

pages = "755--758",

booktitle = "8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013",

note = "8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013 ; Conference date: 07-04-2013 Through 10-04-2013",

}

Ying, W, Lou, W, Yue, Z & Wang, F 2013, High impact-induced failure of a novel solid MEMS switch. in 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013., 6559838, 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013, pp. 755-758, 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013, Suzhou, China, 7/04/13. https://doi.org/10.1109/NEMS.2013.6559838

High impact-induced failure of a novel solid MEMS switch. / Ying, Wang; Lou, Wenzhong; Yue, Zhao et al.
8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013. 2013. p. 755-758 6559838 (8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Ying, Wang

AU - Lou, Wenzhong

AU - Yue, Zhao

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N2 - Due to the rapidly growing MEMS initiator market and the needs for smaller, safer and higher integration, more advanced switches are in demand. The novel solid MEMS switch can improve the security and reliability of MEMS initiator, while the leads of its package are weak under high impact. This paper mainly studied the leads reliability of the novel solid MEMS switch under high impact by FEM simulation analysis. Through simulation analysis, the mainly weakness and the potential failure modes of the leads under high impact can be obtained, which can provide theory reference for the design and application of the novel solid MEMS switch.

AB - Due to the rapidly growing MEMS initiator market and the needs for smaller, safer and higher integration, more advanced switches are in demand. The novel solid MEMS switch can improve the security and reliability of MEMS initiator, while the leads of its package are weak under high impact. This paper mainly studied the leads reliability of the novel solid MEMS switch under high impact by FEM simulation analysis. Through simulation analysis, the mainly weakness and the potential failure modes of the leads under high impact can be obtained, which can provide theory reference for the design and application of the novel solid MEMS switch.

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M3 - Conference contribution

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Y2 - 7 April 2013 through 10 April 2013

ER -

High impact-induced failure of a novel solid MEMS switch

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