Etching rate enhancement by shaped femtosecond pulse train electron dynamics control for microchannels fabrication in fused silica glass

The dependence of the etching rate on the ultrafast pulse shaping is observed when microchannels are fabricated in fused silica glass using the method of femtosecond laser irradiation followed by chemical etching. In comparison with the conventional femtosecond pulses, the temporally shaped pulse trains can greatly enhance the etching rate under the same processing conditions. The enhancement is mainly attributed to the localized transient electron dynamics control by shaping the ultrafast pulse, resulting in higher photon absorption efficiency and uniform photomodification zone. Furthermore, processing parameters, including pulse delay and pulse energy distribution ratio, have also been investigated to optimize microchannels fabrication.