Abstract
This study simulates thermal conductivity via a carrier scattering mechanism and the related parameters are obtained based on first principles for intrinsic and doped silicon carbide (SiC) over a temperature range of 300-1450K. The theoretical analysis results show that the thermal conductivity decreases with increasing temperature along each orientation for both cubic SiC (3C-SiC) and doped SiC. Compared with traditional calculations, the thermal conductivity of doped SiC is larger than that of intrinsic SiC in the high-temperature region. In particular, the n-type thermal conductivity is higher than the p-type thermal conductivity because of the scattering probability between electrons and the ionization impurity increasing with the temperature. Our studies are important to a further understanding of thermal transportation.
Original language | English |
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Article number | 445802 |
Journal | Journal of Physics Condensed Matter |
Volume | 24 |
Issue number | 44 |
DOIs | |
Publication status | Published - 7 Nov 2012 |