Effects of nano-SiO2 additions on wettability and interfacial IMC growth of SAC solder on Ni-xSiO2 composite electroless clad layer

Yong Wang, Xiaochen Xie, Ying Liu, Xiuchen Zhao

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This paper prepares the Ni-SiO2 composite barrier layer containing different concentration of SiO2 nanoparticles (0g/L, 3g/L, 6g/L and 9g/L respectively). Moreover, it investigates the different concentration effects on the wettability of ternary eutectic Sn-Ag-Cu(SAC) solder on the Ni layer and the growth of interfacial intermetallic compounds(IMC) between the Sn-Ag-Cu solder and the composite coating. In this study, the Ni-xSiO2 composite barrier layers with different concentration of SiO2 nanoparticles were deposited on the surface of pure Cu plate by chemical plating technique. The max wetting Force (Fmax/mN) of SAC solder on the Ni-xSiO2 surface, microstructure and the IMC growth of solder/Ni-xSiO2 composite interface under different aging time at 170 were discussed. In comparison with the Ni barrier without SiO2, the wettability of SAC solder on the Ni-xSiO2 surface will increase evidently. Cross-section studies indicate that added SiO2 nanoparticles can inhibit interfacial IMC growth effectively.

Original languageEnglish
Title of host publicationProceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018
EditorsFei Xiao, Jun Wang, Lin Chen, Tianchun Ye
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages753-756
Number of pages4
ISBN (Electronic)9781538663868
DOIs
Publication statusPublished - 2 Oct 2018
Event19th International Conference on Electronic Packaging Technology, ICEPT 2018 - Shanghai, China
Duration: 8 Aug 201811 Aug 2018

Publication series

NameProceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018

Conference

Conference19th International Conference on Electronic Packaging Technology, ICEPT 2018
Country/TerritoryChina
CityShanghai
Period8/08/1811/08/18

Keywords

  • Aging
  • Intermetallic compound
  • Ni barrier layer
  • SiO nanoparticles
  • Wettability

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