Abstract
In order to develop high density power amplifier (PA) with small volume, low cost, and high performance, the LTCC embedded inductor was studied in this paper. Some critical parameters of packaging and interconnection of the LTCC integrated PA were simulated and optimized by using commercial 3D electromagnetic field analysis software HFSS. The gain, VSWR and the power added efficiency of the 450 MHz power amplifier module for CDMA mobile phone are 29 dB, 2: 1, and 34%, respectively. The volume of the PAM is only 6 mm × 6 mm × 1.2 mm.
| Original language | English |
|---|---|
| Pages (from-to) | 477-480 |
| Number of pages | 4 |
| Journal | Guti Dianzixue Yanjiu Yu Jinzhan/Research and Progress of Solid State Electronics |
| Volume | 26 |
| Issue number | 4 |
| Publication status | Published - Nov 2006 |
| Externally published | Yes |
Keywords
- HFSS
- Low temperature co-fired ceramic (LTCC)
- Power amplifier module