Calculation of temperature fields of bodies in sliding contact without lubrication

Hui Chen*, Yuanzhong Hu, Hui Wang, Wenzhong Wang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)

Abstract

A model was established to predict the frictional heat generation and conduction for bodies in sliding contact without lubrication to calculate the local temperature rise that greatly influences the glue, wear, and local plastic deformation. Fast Fourier transforms were used to solve the Laplacian equation of heat conduction. The analysis predicted the transient temperature rises of smooth and rough surfaces and the temperatures of discrete points in the half-infinite bodies in contact without lubrication. The results indicate that the frictional heat generation and thermal conduction are directly related to the local contact pressure, friction coefficient, and relative sliding speed. The results also show that the transient temperature rise of a rough surface is much higher than that of a smooth surface for the same load.

Original languageEnglish
Pages (from-to)1962-1964
Number of pages3
JournalQinghua Daxue Xuebao/Journal of Tsinghua University
Volume47
Issue number11
Publication statusPublished - Nov 2007
Externally publishedYes

Keywords

  • Contact pressure
  • Dry contact
  • Influence coefficient
  • Temperature field

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