An ultrasonic model for revealing electronic package's inner structure using acoustic impedance

C. Xu; Z. Liu; J. Hao; X. Zhao

doi:10.1063/1.3582779

An ultrasonic model for revealing electronic package's inner structure using acoustic impedance

C. Xu^*, Z. Liu, J. Hao, X. Zhao

^*Corresponding author for this work

School of Mechanical Engineering

Beijing Institute of Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Citations (Scopus)

Abstract

The reflected ultrasonic echo's amplitude is relative to the sample material's acoustic impedance change. So the distribution of acoustic impedance is correlated with the inner structure. In this paper, an ultrasonic model is suggested to reveal electronic package's inner structure using acoustic impedance. The model first reconstructs the impedance profile of layered medium through an incidence point, then gets other position's impedance by moving the transducer regularly. Finally, the inner structure of the package can be revealed by the 3D image formed with the impedance matrix.

Original language	English
Title of host publication	Review of Progress in Quantitative Nondestructive Evaluation
Pages	91-94
Number of pages	4
DOIs	https://doi.org/10.1063/1.3582779
Publication status	Published - 2011
Event	37th Annual Review of Progress in Quantitative Nondestructive Evaluation, QNDE - San Diego, CA, United States Duration: 18 Jul 2010 → 23 Jul 2010

Publication series

Name	AIP Conference Proceedings
Volume	1335
ISSN (Print)	0094-243X
ISSN (Electronic)	1551-7616

Conference

Conference	37th Annual Review of Progress in Quantitative Nondestructive Evaluation, QNDE
Country/Territory	United States
City	San Diego, CA
Period	18/07/10 → 23/07/10

Keywords

Acoustic Impedance
Electronic Package
Ultrasonic Model

Access to Document

10.1063/1.3582779

Cite this

Xu, C., Liu, Z., Hao, J., & Zhao, X. (2011). An ultrasonic model for revealing electronic package's inner structure using acoustic impedance. In Review of Progress in Quantitative Nondestructive Evaluation (pp. 91-94). (AIP Conference Proceedings; Vol. 1335). https://doi.org/10.1063/1.3582779

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title = "An ultrasonic model for revealing electronic package's inner structure using acoustic impedance",

abstract = "The reflected ultrasonic echo's amplitude is relative to the sample material's acoustic impedance change. So the distribution of acoustic impedance is correlated with the inner structure. In this paper, an ultrasonic model is suggested to reveal electronic package's inner structure using acoustic impedance. The model first reconstructs the impedance profile of layered medium through an incidence point, then gets other position's impedance by moving the transducer regularly. Finally, the inner structure of the package can be revealed by the 3D image formed with the impedance matrix.",

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Xu, C, Liu, Z, Hao, J & Zhao, X 2011, An ultrasonic model for revealing electronic package's inner structure using acoustic impedance. in Review of Progress in Quantitative Nondestructive Evaluation. AIP Conference Proceedings, vol. 1335, pp. 91-94, 37th Annual Review of Progress in Quantitative Nondestructive Evaluation, QNDE, San Diego, CA, United States, 18/07/10. https://doi.org/10.1063/1.3582779

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AU - Zhao, X.

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N2 - The reflected ultrasonic echo's amplitude is relative to the sample material's acoustic impedance change. So the distribution of acoustic impedance is correlated with the inner structure. In this paper, an ultrasonic model is suggested to reveal electronic package's inner structure using acoustic impedance. The model first reconstructs the impedance profile of layered medium through an incidence point, then gets other position's impedance by moving the transducer regularly. Finally, the inner structure of the package can be revealed by the 3D image formed with the impedance matrix.

AB - The reflected ultrasonic echo's amplitude is relative to the sample material's acoustic impedance change. So the distribution of acoustic impedance is correlated with the inner structure. In this paper, an ultrasonic model is suggested to reveal electronic package's inner structure using acoustic impedance. The model first reconstructs the impedance profile of layered medium through an incidence point, then gets other position's impedance by moving the transducer regularly. Finally, the inner structure of the package can be revealed by the 3D image formed with the impedance matrix.

KW - Acoustic Impedance

KW - Electronic Package

KW - Ultrasonic Model

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An ultrasonic model for revealing electronic package's inner structure using acoustic impedance

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Keywords

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