超声振动辅助微镦粗仿真及试验研究

Translated title of the contribution: Simulation and experiment study on ultrasonic vibration assisted micro upsetting

Siqin Pang, Chunfeng Ma, Tianfeng Zhou*, Guang Li, Zhiqiang Liang, Xibin Wang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

To reduce the micro upsetting force, extend the life of the mold and improve the plasticity and the forming quality of material, the ultrasonic vibration assisted micro upsetting was studied. Modeling and simulation of ultrasonic vibration assisted micro upsetting on copper was carried out to study the effect of ultrasonic parameters on forming force and deformation, and the results showed that the ultrasonic vibration could reduce the micro upsetting force and increase the deformation, the force reduction and deformation increase had a positive linear relationship with the ultrasonic amplitude and a non-linear positive correlation with the ultrasonic frequency. Ultrasonic vibration assisted micro forming platform was built up and the micro upsetting force curves, the surface topography and size of the specimen under different ultrasonic powers were obtained. Experimental results showed that the micro upsetting force reduction increased with the increasing of ultrasonic power. The surface topography was improved with the increasing of ultrasonic power when the power was lower than 1.50 kW. But the surface topography was worse with the increasing of ultrasonic power when the power was higher than 1.50 kW. Simulation and experiment study showed that the ultrasonic vibration could effectively reduce the micro upsetting force, increase plastic deformation, reduce the drum shape and improve the surface topography and forming uniformity.

Translated title of the contributionSimulation and experiment study on ultrasonic vibration assisted micro upsetting
Original languageChinese (Traditional)
Pages (from-to)70-77
Number of pages8
JournalHarbin Gongye Daxue Xuebao/Journal of Harbin Institute of Technology
Volume53
Issue number1
DOIs
Publication statusPublished - 30 Jan 2021

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