Research output per year
Research output per year
Personal profile
Personal profile
Hu Shanting
Associate Research Fellow
Date of birth: December 1989
Office Tel: 010-6891820
E-mail: hushanting@bit.edu.cn
2021.12 till now: School of Information and Electronics, Beijing Institute of Technology
2019.04-2021.12: Institute of Future Industrial Technology, Tokyo Institute of Technology
2014.09-2019.04: Studied at Tokyo Institute of Technology, majoring in Electrical and Electronic Engineering (Master Degree) 2011.09-2014.09: Studied in Beijing University of Posts and Telecommunications, majoring in Optical Engineering for a master's degree. 2007.09-2011.06: Majored in Information Engineering at Beijing University of Posts and Telecommunications
Associate Research Fellow
Date of birth: December 1989
Office Tel: 010-6891820
E-mail: hushanting@bit.edu.cn
2021.12 till now: School of Information and Electronics, Beijing Institute of Technology
2019.04-2021.12: Institute of Future Industrial Technology, Tokyo Institute of Technology
2014.09-2019.04: Studied at Tokyo Institute of Technology, majoring in Electrical and Electronic Engineering (Master Degree) 2011.09-2014.09: Studied in Beijing University of Posts and Telecommunications, majoring in Optical Engineering for a master's degree. 2007.09-2011.06: Majored in Information Engineering at Beijing University of Posts and Telecommunications
Research Interests
Ultra-high-speed optical modulation, high-power optical amplification, high-precision optical scanning and photonic integration technology based on Vertical cavity Surface Emitting Laser (VCSEL) optics
Education
2021.12 till now: School of Information and Electronics, Beijing Institute of Technology
2019.04-2021.12: Institute of Future Industrial Technology, Tokyo Institute of Technology
2014.09-2019.04: Studied at Tokyo Institute of Technology, majoring in Electrical and Electronic Engineering (Master Degree) 2011.09-2014.09: Studied in Beijing University of Posts and Telecommunications, majoring in Optical Engineering for a master's degree. 2007.09-2011.06: Majored in Information Engineering at Beijing University of Posts and Telecommunications
Professional Experience
2021.12 till now: School of Information and Electronics, Beijing Institute of Technology
2019.04-2021.12: Institute of Future Industrial Technology, Tokyo Institute of Technology
2014.09-2019.04: Studied at Tokyo Institute of Technology, majoring in Electrical and Electronic Engineering (Master Degree) 2011.09-2014.09: Studied in Beijing University of Posts and Telecommunications, majoring in Optical Engineering for a master's degree. 2007.09-2011.06: Majored in Information Engineering at Beijing University of Posts and Telecommunications
Research Achievement
He has published 15 SCI papers in the Journal of Lightwave Technology, Optics Express, Applied Physics Letters and other famous international academic journals. He has made oral presentations at international top academic conferences such as ISLC, OFC, CLEO and so on for more than 10 times, and was invited to deliver a report once, winning the best paper award at the conference for many times.
2017 International Nano-Optolectronics Workshop Best Paper Award
2019 International Nano-Optolectronics Workshop Best Paper Award
2021 26th Microoptics Conference(MOC) Best Paper Award
2021 ELEX Best Paper Award
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Collaborations and top research areas from the last five years
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1060-nm single-mode transverse coupled cavity VCSEL with intra-cavity surface relief for 58-Gbps modulation and 5-km single-mode fiber transmission
Hu, S., Gu, X., Ibrahim, H. R., Nakahama, M., Shinada, S. & Koyama, F., 27 Jun 2022, In: Applied Physics Letters. 120, 26, 261110.Research output: Contribution to journal › Article › peer-review
9 Citations (Scopus) -
1060nm Single-mode Transverse Coupled Cavity VCSEL with Surface Relief Engineering for 80Gbps PAM4 Modulation
Hu, S., Gu, X., Ibrahim, H. R., Nakahama, M., Shinada, S. & Koyama, F., 2022, In: Optics InfoBase Conference Papers. M3D.3.Research output: Contribution to journal › Conference article › peer-review
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1060nm Single-mode Transverse Coupled Cavity VCSEL with Surface Relief Engineering for 80Gbps PAM4 Modulation
Hu, S., Gu, X., Ibrahim, H. R., Nakahama, M., Shinada, S. & Koyama, F., 2022, 2022 Optical Fiber Communications Conference and Exhibition, OFC 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc., M3D.3. (2022 Optical Fiber Communications Conference and Exhibition, OFC 2022 - Proceedings).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
2 Citations (Scopus) -
5-km Single-mode Fiber Data Transmission with 1060nm Single-mode Intra-cavity Surface Relief Transverse Coupled Cavity VCSELs
Hu, S., Gu, X., Ibrahim, H. R. & Koyama, F., 2022, 2022 28th International Semiconductor Laser Conference, ISLC 2022. Institute of Electrical and Electronics Engineers Inc., (Conference Digest - IEEE International Semiconductor Laser Conference; vol. 2022-October).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Densely packed 1.1 μm band vertical cavity surface emitting laser array for co-packaged optics
Dong, L., Gu, X., Hu, S. & Koyama, F., 1 Aug 2022, In: Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers. 61, SK, SK1011.Research output: Contribution to journal › Article › peer-review
Open Access1 Citation (Scopus)