摘要
Stretchable and curved electronic devices are a promising technology trend due to their remarkable advantages. Many approaches have been developed to manufacture stretchable and curved electronics. Here, to allow such electronics to better serve practical applications, ranging from wearable devices to soft robotics, we propose a novel vertical serpentine conductor (VSC) with superior electrical stability to interconnect functional devices through a silicon-based microfabrication process. Conformal vacuum transfer printing (CVTP) technology was developed to transfer the networked platform onto complex curved surfaces to demonstrate feasibility. The mechanical and electrical performance were investigated numerically and experimentally. The VSC interconnected network provides a new approach for stretchable and curved electronics with high stretchability and reliability. [Figure not available: see fulltext.]
| 源语言 | 英语 |
|---|---|
| 期刊论文编号 | 149 |
| 期刊 | Microsystems and Nanoengineering |
| 卷 | 9 |
| 期 | 1 |
| DOI | |
| 出版状态 | 已出版 - 12月 2023 |
| 已对外发布 | 是 |
学术指纹
探究 'Vertical serpentine interconnect-enabled stretchable and curved electronics' 的科研主题。它们共同构成独一无二的学术指纹。引用此
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver