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Vertical serpentine interconnect-enabled stretchable and curved electronics

  • Rui Jiao
  • , Ruoqin Wang
  • , Yixin Wang
  • , Yik Kin Cheung
  • , Xingru Chen
  • , Xiaoyi Wang
  • , Yang Deng*
  • , Hongyu Yu*
  • *此作品的通讯作者
  • Hong Kong University of Science and Technology
  • HKUST Shenzhen-Hong Kong Collaborative Innovation Research Institute

科研成果: 期刊稿件 › 文章 › 同行评审

摘要

Stretchable and curved electronic devices are a promising technology trend due to their remarkable advantages. Many approaches have been developed to manufacture stretchable and curved electronics. Here, to allow such electronics to better serve practical applications, ranging from wearable devices to soft robotics, we propose a novel vertical serpentine conductor (VSC) with superior electrical stability to interconnect functional devices through a silicon-based microfabrication process. Conformal vacuum transfer printing (CVTP) technology was developed to transfer the networked platform onto complex curved surfaces to demonstrate feasibility. The mechanical and electrical performance were investigated numerically and experimentally. The VSC interconnected network provides a new approach for stretchable and curved electronics with high stretchability and reliability. [Figure not available: see fulltext.]

源语言英语
期刊论文编号149
期刊Microsystems and Nanoengineering
卷9
期1
DOI
出版状态已出版 - 12月 2023
已对外发布是

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