Variable thermal expansion in CuIn P2 S6

Materials normally exhibit positive thermal expansion, and materials with negative thermal expansion coefficient are of great interest for both fundamental study and applications such as high-precision microscale actuators, thermal expansion compensators, etc. Here, the coefficients of linear thermal expansion (αL) along the c axis of the layered ferroelectric CuInP2S6 have been measured. In the single-crystalline bulk specimen, αL exhibits large negative thermal expansion up to -20.05×10-6K-1 in the temperature range below 150 K. In contrast to the bulk, exfoliated ultrathin CuInP2S6 flakes exhibit an overall positive αL∼26.8×10-6K-1. The thickness-dependent thermal expansion of CuInP2S6 crystal may facilitate the design of van der Waals heterostructures and ferroelectric devices with tunable thermal responses.