TY - GEN
T1 - Ultra-broadband common collector-cascode 4-cell distributed amplifier in 250nm InP HBT technology with over 200 GHz bandwidth
AU - Giannakopoulos, Stavros
AU - Eriksson, Klas
AU - Darwazeh, Izzat
AU - He, Zhongxia Simon
AU - Zirath, Herbert
N1 - Publisher Copyright:
© 2017 European Microwave Association.
PY - 2017/12/19
Y1 - 2017/12/19
N2 - An ultra broadband MMIC amplifier is designed using InP double-heterojunction bipolar transistors and its on-chip measurements are reported. The multi-cell distributed amplifier uses four gain cells where each consists of a common collector input stage followed by a cascode gain stage. The chip includes bias, decoupling and terminating circuits for the dc and RF interconnects; it measures 0.72 mm by 0.4 mm. It consumes 210 mW of power and can deliver up to 5.5 dBm of output power at 195 GHz. The amplifier achieves an average gain of 13.5 dB with an overall bandwidth over 200 GHz and a ± 2 dB gain ripple. The measurements indicate that this is the widest band dc-coupled amplifier reported to date and has the highest bandwidth reported among non-cascaded distributed amplifiers.
AB - An ultra broadband MMIC amplifier is designed using InP double-heterojunction bipolar transistors and its on-chip measurements are reported. The multi-cell distributed amplifier uses four gain cells where each consists of a common collector input stage followed by a cascode gain stage. The chip includes bias, decoupling and terminating circuits for the dc and RF interconnects; it measures 0.72 mm by 0.4 mm. It consumes 210 mW of power and can deliver up to 5.5 dBm of output power at 195 GHz. The amplifier achieves an average gain of 13.5 dB with an overall bandwidth over 200 GHz and a ± 2 dB gain ripple. The measurements indicate that this is the widest band dc-coupled amplifier reported to date and has the highest bandwidth reported among non-cascaded distributed amplifiers.
UR - https://www.scopus.com/pages/publications/85045883952
U2 - 10.23919/EuMIC.2017.8230680
DO - 10.23919/EuMIC.2017.8230680
M3 - Conference contribution
AN - SCOPUS:85045883952
T3 - 2017 12th European Microwave Integrated Circuits Conference, EuMIC 2017
SP - 142
EP - 145
BT - 2017 12th European Microwave Integrated Circuits Conference, EuMIC 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 12th European Microwave Integrated Circuits Conference, EuMIC 2017
Y2 - 9 October 2017 through 12 October 2017
ER -