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Trans-scale interphase engineering for enhanced interfacial reinforcement between ‘rigid’ HMX crystals and ‘soft’ binders

  • Jie Li
  • , Chunbo Shi
  • , Shiliang Huang
  • , Shichun Li
  • , Jinjiang Xu
  • , Shaohua Jin*
  • , Yu Liu
  • *此作品的通讯作者
  • Beijing Institute of Technology
  • China Academy of Engineering Physics

科研成果: 期刊稿件文章同行评审

摘要

Polymer-bonded explosives (PBXs) balance energy density and mechanical performance by integrating rigid high-energy crystals within soft polymer matrices. However, interfacial incompatibility from large modulus mismatch induces inefficient stress transfer, localized stress concentrations, and premature failure. Inspired by biological modulus gradients bridging soft/hard tissues, we engineer the octahydro-1,3,4,7-tetranitro-1,3,5,7-tetrazocine (HMX) / F2314 interface via in situ construction of nanoscale surface structures dimension-matched to the radius of gyration (Rg) of F2314 chains. These nanostructures act as molecular anchors, constraining polymer mobility to induce a crystalline/semi-crystalline interphase. This yields a sixfold-thicker interphase (509 ± 42 nm vs. 67 ± 25 nm), establishing a continuous mechanical gradient from rigid HMX to soft matrix. The gradient interphase shifts failure modes from interfacial debonding to cohesive matrix rupture and trans-granular fracture, confirming enhanced stress transfer. Mechanical/morphological analyses verify improved load-bearing without compromising energetic performance. Crucially, this modifier-free strategy enables scalable interfacial reinforcement for next-generation PBXs. Crack redirection through the graded interphase and optimized stress distribution significantly enhance damage resistance and interfacial stability.

源语言英语
期刊论文编号114518
期刊Materials and Design
258
DOI
出版状态已出版 - 10月 2025
已对外发布

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