@inproceedings{321fb809d7904a11a16dcc105702e062,
title = "Thermo-mechanical reliability evaluation for microelectronic packaging using C-mode scanning acoustic microscopy",
abstract = "C-mode Scanning Acoustic Microscopy (C-SAM) is an excellent tool for nondestructive failure analysis and reliability evaluation of microelectronic packaging. During operation and thermal cycling, defects such as cracks, delamination and voids can emerge and grow under thermo-mechanical stresses caused by materials with different coefficients of thermal expansion (CTE) and mechanical properties. According to the MIL-STD-883H Microcircuits Test Method Standard, the thermal cycling test on a set of microelectronic packaging was conducted and the defects propagation of microelectronic packaging was studied experimentally using C-mode Scanning Acoustic Microscopy.",
keywords = "Microelectronic Packaging, Reliability, Thermo-Mechanical, and C-SAM",
author = "Guo, \{X. H.\} and Xu, \{C. G.\} and L. Yang and Liu, \{Z. Z.\} and Zhao, \{X. Y.\} and Wang, \{H. B.\} and K. Peng",
note = "Publisher Copyright: {\textcopyright} 2013 American Institute of Physics.; 39th Annual Review of Progress in Quantitative Nondestructive Evaluation, QNDE 2012 ; Conference date: 15-07-2012 Through 20-07-2012",
year = "2013",
doi = "10.1063/1.4789259",
language = "English",
series = "AIP Conference Proceedings",
publisher = "American Institute of Physics Inc.",
pages = "1803--1808",
editor = "Chimenti, \{Dale E.\} and Thompson, \{Donald O.\}",
booktitle = "Review of Progress in Quantitative Nondestructive Evaluation, Volume 32",
address = "United States",
}