@inproceedings{782ba72030c944eca3c5dae579c9a623,
title = "The microstructure and mechanical property of the high entropy alloy as a low temperature solder",
abstract = "In this paper, we studied the high entropy alloy (HEA) of SnBiInZn as a low temperature solder with a melting point about 80 oC. The microstructure of the HEA solder is very complicated. There are three phases at least in the solder, including Bi-rich phase, Sn-rich phase and InBi phase. The wetting reaction between the solder and Cu substrate was conducted at 100 oC and 120 oC. The wetting angle ranges from 30 to 40 degrees, indicating that the solder has a good wetting ability even at such low soldering temperature. The scallop and finger shape intermetallic compounds were determined to be Cu6Sn5. The thickness measurement of the IMC layer shows that the interfacial reaction rate is very slow. The shear stress ranges from 19 MPa to 28 MPa, which indicates that the solder joint is strong enough for electronic packaging technology.",
keywords = "Entropy alloy, Intermetallic compound, Low temperature solder, Microstructure, Shear stress",
author = "Li Pu and Quanfeng He and Yong Yang and Xiuchen Zhao and Zhuangzhuang Hou and Tu, \{K. N.\} and Yingia Liu",
note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 69th IEEE Electronic Components and Technology Conference, ECTC 2019 ; Conference date: 28-05-2019 Through 31-05-2019",
year = "2019",
month = may,
doi = "10.1109/ECTC.2019.00263",
language = "English",
series = "Proceedings - Electronic Components and Technology Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1716--1721",
booktitle = "Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019",
address = "United States",
}