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Substrate-Mediated Boosting of the Co3+/Co2+Pair for Highly Active and Durable Oxygen Evolution Electrocatalysis

  • Jing Xu
  • , Jinou Zheng
  • , Tao Yang*
  • , Zhonghuai Wu*
  • , Sai Li
  • , Chen Xiao
  • , Xin Wang
  • , Yang Wang
  • , Shouyi Xie
  • , Hao Tan
  • , Zheng Zhou*
  • *此作品的通讯作者
  • Southwest Jiaotong University
  • Shenzhen Technology University
  • Beijing Institute of Technology
  • Sichuan University
  • The University of Sydney
  • College of Chemistry and Chemical Engineering

科研成果: 期刊稿件文章同行评审

摘要

Boosting the trivalent/divalent metal (M3+/M2+) redox pair in 3d metal compounds (TMCs) can facilitate the surface reconstruction during the oxygen evolution reaction (OER), transforming TMCs into trivalent metal oxyhydroxide (MOOH) species, which has been demonstrated to be the essential phase of the active substance. Herein, we examined an indirect strategy by the proof-of-concept of cobalt phosphide (CoP), that is, leveraging the strong substrate effect of Ti3C2Tx MXene to boost the Co3+/Co2+ pair, validated by X-ray absorption near-edge spectroscopy (XANES). The resulting CoP@Ti3C2Tx electrocatalyst achieves an ultralow overpotential of 218 mV at 10 mA cm–2 and a small Tafel slope of 52 mV dec–1 on the glassy carbon electrode and can operate stably over 500 h in a water electrolyzer, outperforming most non-noble metal electrocatalysts. Operando attenuated total reflection surface-enhanced infrared absorption spectroscopy (ATR-SEIRAS), operando Raman spectra, and theoretical calculations reveal an adsorbate evolution mechanism (AEM) for CoP@Ti3C2Tx, suggesting the high activity typically associated with lattice oxygen-mediated mechanism (LOM) catalysts while inheriting the excellent stability of AEM-driven systems. This work highlights substrate engineering as an effective indirect strategy to boost the M3+/M2+ pair, providing a paradigm for designing OER electrocatalysts with both high activity and long-term stability.

源语言英语
页(从-至)11457-11466
页数10
期刊ACS Applied Materials and Interfaces
18
7
DOI
出版状态已出版 - 25 2月 2026

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