摘要
Thermoelectric Peltier coolers (PCs) are being increasingly used as temperature stabilizers for optoelectronic devices. Increasing integration drives PC miniaturization, requiring thermoelectric materials with good strength. We demonstrate a simultaneous gain of thermoelectric and mechanical performance in (Bi, Sb)2Te3, and successfully fabricate micro PCs (2 × 2 mm2 cross-section) that show excellent maximum cooling temperature difference of 89.3 K with a hot-side temperature of 348 K. A multi-step process involving annealing, hot-forging and composition design, is developed to modify the atomic defects and nano- and microstructures. The peak ZT is improved to ∼1.50 at 348 K, and the flexural and compressive strengths are significantly enhanced to ∼140 MPa and ∼224 MPa, respectively. These achievements hold great potential for advancing solid-state refrigeration technology in small spaces.
| 源语言 | 英语 |
|---|---|
| 文章编号 | nwae329 |
| 期刊 | National Science Review |
| 卷 | 11 |
| 期 | 10 |
| DOI | |
| 出版状态 | 已出版 - 1 10月 2024 |
| 已对外发布 | 是 |
指纹
探究 'Strong and efficient bismuth telluride-based thermoelectrics for Peltier microcoolers' 的科研主题。它们共同构成独一无二的指纹。引用此
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