摘要
Simulations and experiments on three kinds of Si tip fabrication techniques had been done, which are Anisotropic Dry Etching (ADE), Anisotropic Wet Etching (AWE) and AWE combining with bonding. The simulation results showed that the parameters applied in the ADE and AWE should be controlled much more precisely than AWE combining with bonding to get expected tips. The experiments prove that the parameters of fabricating silicon tip by ADE and AWE have little tolerance. The conclusions on AWE combining with bonding drew from simulations are verified in the detail experiments. From the simulations and experiments, excellent reliability and controllability are witnessed in AWE combining with bonding and a tip with top diameter within 23.44nm had been achieved.
源语言 | 英语 |
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页(从-至) | 35-41 |
页数 | 7 |
期刊 | Proceedings of SPIE - The International Society for Optical Engineering |
卷 | 5342 |
DOI | |
出版状态 | 已出版 - 2004 |
已对外发布 | 是 |
活动 | Micromachining and Microfabrication Process Technology IX - San Jose, CA., 美国 期限: 27 1月 2004 → 29 1月 2004 |