TY - JOUR
T1 - Research on Flexible Integration Methods for MEMS Safety and Arming Device
AU - Lu, Yi
AU - Feng, Hengzhen
AU - Lou, Wenzhong
AU - Kan, Wenxing
AU - Ren, Jie
AU - Xiao, Chuan
N1 - Publisher Copyright:
© 2026 Institute of Physics Publishing. All rights reserved.
PY - 2026
Y1 - 2026
N2 - The integration of micro-miniature fuze safety and arming devices and pyrotechnic devices using conventional MEMS processes presents significant challenges due to limitations imposed by temperature constraints and inherent response characteristics. This study proposes a novel approach to the room-temperature, heterogeneous integration of these devices. The method uses polymer materials, such as flexible bonding adhesives and PDMS (polydimethylsiloxane), to integrate silicon-based safety and arming devices with the acceleration chamber and metallic flyer layer within the micro-explosion sequence. We systematically analyze the viscoelastic properties and stress intensity variation mechanisms of these flexible materials and optimize the curing agent ratio to construct a stress-buffering structure. Mechanical performance tests and characterization confirm that the flexible bonding adhesive achieves a maximum integration strength of 143 – 161 megapascals (MPa), while the polydimethylsiloxane (PDMS)-based flexible integration exhibits a bonding strength of 150–160 MPa, representing a maximum strength enhancement of 41.3%. This method is highly applicable to the heterogeneous integration of multiple components in MEMS fuze.
AB - The integration of micro-miniature fuze safety and arming devices and pyrotechnic devices using conventional MEMS processes presents significant challenges due to limitations imposed by temperature constraints and inherent response characteristics. This study proposes a novel approach to the room-temperature, heterogeneous integration of these devices. The method uses polymer materials, such as flexible bonding adhesives and PDMS (polydimethylsiloxane), to integrate silicon-based safety and arming devices with the acceleration chamber and metallic flyer layer within the micro-explosion sequence. We systematically analyze the viscoelastic properties and stress intensity variation mechanisms of these flexible materials and optimize the curing agent ratio to construct a stress-buffering structure. Mechanical performance tests and characterization confirm that the flexible bonding adhesive achieves a maximum integration strength of 143 – 161 megapascals (MPa), while the polydimethylsiloxane (PDMS)-based flexible integration exhibits a bonding strength of 150–160 MPa, representing a maximum strength enhancement of 41.3%. This method is highly applicable to the heterogeneous integration of multiple components in MEMS fuze.
KW - Flexible Bonding Adhesives
KW - Flexible Integration
KW - MEMS Safety and Arming Devices
KW - PDMS
KW - Pyrotechnic Devices
UR - https://www.scopus.com/pages/publications/105035200183
U2 - 10.1088/1742-6596/3184/1/012019
DO - 10.1088/1742-6596/3184/1/012019
M3 - Conference article
AN - SCOPUS:105035200183
SN - 1742-6588
VL - 3184
JO - Journal of Physics: Conference Series
JF - Journal of Physics: Conference Series
IS - 1
M1 - 012019
T2 - 27th Annual Conference and 16th International Conference of Chinese Society of Micro-Nano Technology, CSMNT 2025
Y2 - 21 November 2025 through 24 November 2025
ER -