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Power-aware high level evaluation model of interconnect length of on-chip memory network topology

  • Xiao Jun Wang
  • , Feng Shi*
  • , Yi Zhuo Wang
  • , Hong Zhang
  • , Xu Chen
  • , Wen Fei Fu
  • *此作品的通讯作者
  • Beijing Institute of Technology

科研成果: 期刊稿件文章同行评审

摘要

Interconnect power is the factor that dominates the power consumption on the on-chip memory architecture. Almost all dedicated wires and buses are replaced with packet switching interconnection networks which have become the standard approach to on-chip interconnection. Unfortunately, rapid advances in technology are making it more difficult to assess the interconnect power consumption of NoC. To resolve this problem, a new evaluating methodology for interconnect power evaluation based on topology of on-chip memory (IPETOM) is proposed in this paper. To validate this method, two multicore architectures 2D-mesh and triplet-based architecture (TriBA) are evaluated in this research work. The on-chip memory network model is evaluated based on characteristics of on-chip architecture interconnection. MATLAB is used for conducting the experiment that evaluates the interconnection power of TriBA and 2D-mesh.

源语言英语
页(从-至)422-431
页数10
期刊International Journal of Computational Science and Engineering
17
4
DOI
出版状态已出版 - 2018

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