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Physical Insights into the Transport Properties of RRAMs Based on Transition Metal Oxides

  • Toufik Sadi*
  • , Oves Badami
  • , Vihar Georgiev
  • , Jie Ding
  • , Asen Asenov
  • *此作品的通讯作者
  • Aalto University
  • University of Glasgow
  • Taiyuan University of Technology

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

Nowadays, resistive random-Access memories (RRAMs) are widely considered as the next generation of non-volatile memory devices. Here, we employ a physics-based multi-scale kinetic Monte Carlo simulator to study the microscopic transport properties and characteristics of promising RRAM devices based on transition metal oxides, specifically hafnium oxide (HfOx) based structures. The simulator handles self-consistently electronic charge and thermal transport in the three-dimensional (3D) space, allowing the realistic study of the dynamics of conductive filaments responsible for switching. By presenting insightful results, we argue that using a simulator of a 3D nature, accounting for self-consistent fields and self-heating, is necessary for understanding switching in RRAMs. As an example, we look into the unipolar operation mode, by showing how only the correct inclusion of self-heating allows the proper reconstruction of the switching behaviour. The simulation framework is well-suited for exploring the operation and reliability of RRAMs, providing a reliable computational tool for the optimization of existing device technologies and the path finding and development of new RRAM options.

源语言英语
主期刊名Proceedings of 2019 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2019
编辑Francesco Driussi
出版商Institute of Electrical and Electronics Engineers Inc.
ISBN(电子版)9781728109404
DOI
出版状态已出版 - 9月 2019
已对外发布
活动24th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2019 - Udine, 意大利
期限: 4 9月 20196 9月 2019

出版系列

姓名International Conference on Simulation of Semiconductor Processes and Devices, SISPAD
2019-September

会议

会议24th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2019
国家/地区意大利
Udine
时期4/09/196/09/19

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