Patterned Peeling 2D MoS₂ off the Substrate

The performance of two-dimensional (2D) MoS₂ devices depends largely on the quality of the MoS₂ itself. Existing fabrication process for 2D MoS₂ relies on lithography and etching. However, it is extremely difficult to achieve clean patterns without any contaminations or passivations. Here we report a peel-off pattering of MoS₂ films on substrates based on a proper interface engineering. The peel-off process utilizes the strong adhesion between gold and MoS₂ and removes the MoS₂ film contact with gold directly, leading to clean MoS₂ pattern generation without residuals. Significantly improved electrical performances including high mobility ∼17.1 ± 8.3 cm²/(V s) and on/off ratio ∼5.6 ± 3.6 × 10⁶ were achieved. Such clean fabrication technique paves a way to high quality MoS₂ devices for various electrical and optical applications.