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Mechanical analysis of adhesion between wearable electronics and human skin based on crack theory of bi-material interface

  • Yutong Fu
  • , Heng Yang*
  • *此作品的通讯作者
  • Chongqing University
  • Beijing Institute of Technology

科研成果: 期刊稿件 › 文章 › 同行评审

摘要

In recent years, wearable electronics have been gradually applied in the measurement of human health signals with the development of the technology and the increasing attention to health. The application of the electronic device requires it to be attached to the human skin for an extended period of time. Therefore, it is of great significance to define and judge the comfort of flexible electronic devices. This paper focuses on the adhesion between wearable electronics and human skin based on crack theory of bi-material interface. The comfort of the skin is judged by the magnitude and gradient of the stresses, based on the working principle of human tactile receptors. For the comfort design of wearable electronics, the effects of mechanical and geometric parameters for devices on the skin surface stresses are also discussed. This article provides the theoretical basis for improving the comfort of wearable electronic devices.

源语言英语
期刊论文编号111850
期刊International Journal of Solids and Structures
卷254-255
DOI
出版状态已出版 - 1 11月 2022
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  1. 可持续发展目标 3 - 良好健康与福祉
    可持续发展目标 3 良好健康与福祉

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