跳到主要导航 跳到搜索 跳到主要内容

Kinematical characteristics of two-dimensional vertical ultrasonic vibration-assisted grinding technology

  • Y. Peng*
  • , Y. Wu
  • , Z. Liang
  • , Y. Guo
  • *此作品的通讯作者
  • Xiamen University
  • Akita Prefectural University

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

摘要

The ultrasonic vibration-assisted machining (UVAM) technology is increasingly attractive for the ultraprecision machining of brittle materials. But the machining mechanism for UVAM is still unknown, especially for the grinding process. In this paper, the kinematical characteristics of two-dimensional vertical ultrasonic vibration-assisted grinding (UVAG) technology are investigated. A consistent physical modeling of the grinding process with ultrasonic vibration assistance is established firstly, which is based on the interaction of individual grinding grains with the workpiece. Then the kinematical equation is deduced, and so does the velocity and acceleration of a single abrasive grit relative to the workpiece in UVAG. The kinematics of a single abrasive grit during 2D UVAG is simulated for the perpendicular vibration mode. The results show that the relation motion of an abrasive grit is altered significantly with the assistance of ultrasonic vibration, and the grinding path is elongated, which will increase the material removal rate per abrasive grit. The most interesting result is that the relative velocity of an abrasive grit in UVAG is changed slightly when compared to that without ultrasonication. While the relative acceleration in UVAG is increasing tremendously, especially for high frequency ratio (a ratio between the vibration frequency to the rotation frequency) condition. This result means that the ultrasonic vibration assistance can introduce a huge acceleration impact on the material in the machining deformation zone by the grinding grit, and may change the material removal mechanism of grinding. Thus it can do a favor to the precision machining of brittle materials. The UVAG experiment of polysilicon shows that the surface roughness is improved and the normal and tangential grinding forces decrease with the increasing of applied voltage, while the axial grinding force increases. The results indicate that the assistance of ultrasonic vibration can result the change of the grinding mechanism of brittle material.

源语言英语
主期刊名5th International Symposium on Advanced Optical Manufacturing and Testing Technologies
主期刊副标题Advanced Optical Manufacturing Technologies
版本PART 1
DOI
出版状态已出版 - 2010
活动5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies - Dalian, 中国
期限: 26 4月 2010 → 29 4月 2010

丛书

姓名Proceedings of SPIE - The International Society for Optical Engineering
编号PART 1
卷7655
ISSN(印刷版)0277-786X

会议

会议5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies
国家/地区中国
市Dalian
时期26/04/10 → 29/04/10

学术指纹

探究 'Kinematical characteristics of two-dimensional vertical ultrasonic vibration-assisted grinding technology' 的科研主题。它们共同构成独一无二的学术指纹。

引用此