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Joining of high-entropy ceramics (HEC) to Nb using CoFeCrNiCu high-entropy alloy as filler via spark plasma sintering

  • Rui Zhang
  • , Gang Wang*
  • , Wei Wang
  • , Yu Zhao
  • , Rujie He
  • , Caiwang Tan
  • *此作品的通讯作者
  • Anhui Polytechnic University
  • Key Laboratory of Additive Manufacturing (3D Printing) of Anhui Province
  • Anhui Technical College of Mechanical and Electrical Engineering
  • Beijing Institute of Technology
  • Harbin Institute of Technology

科研成果: 期刊稿件文章同行评审

摘要

The (TiZrHfNbTa)C high-entropy ceramic (HEC) and Nb were joined by spark plasma sintering, with CoFeCrNiCu high-entropy alloy serving as the filler material. The typical microstructure of the joint consists of HEC/FCC, Laves, Cu(s,s), and NbC. The impact of joining temperature and holding time on the microstructure, shear strength, and fracture path of the HEC/CoFeCrNiCu/Nb joints were systematically investigated. At the same time, the phase formation mechanism and microstructure evolution of the joint during SPS process are explained. The shear strength of the joint reached a maximum of 52 MPa at room temperature after holding at 1100 °C for 6 min. The high-entropy effect of the CoFeCrNiCu filler promotes the formation of the FCC phase in the central region of the joint. Additionally, due to the diffusion of Nb and C, a diffusion transition layer consisting of the Laves phase and NbC forms near the Nb side, contributing to the enhancement of the shear strength.

源语言英语
文章编号115667
期刊Vacuum
254
DOI
出版状态已出版 - 11月 2026
已对外发布

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