TY - JOUR
T1 - Intraoperatively Tailorable Vascular Bioelectronics for Personalized Hemodynamic Monitoring
AU - Li, Yutong
AU - Xu, Jiaqiang
AU - Guan, Kangdi
AU - Hu, Junhao
AU - Wei, Ruilai
AU - Jiang, Kai
AU - Liu, Zhirong
AU - Shen, Guozhen
N1 - Publisher Copyright:
© 2026 American Chemical Society
PY - 2026/9/15
Y1 - 2026/9/15
N2 - Intraoperative monitoring of vascular and hemodynamic status is critical for preventing postoperative complications. However, interpatient variability in vessel geometry renders rigid or pre-shaped implantable sensors inadequate for conformal adaptation to the surgical site. Here, we present an intraoperatively customizable platform for the rapid fabrication of three-dimensional helical vascular electronics via a controlled mechanical peeling strategy. By modulating peeling parameters, helical structures with tunable diameters and pitches are generated, enabling suture-free wrapping around arteries of varying dimensions and branching architectures. Patterned Ag nanofiber electrodes were integrated via a water-assisted transfer method, exhibiting low electrical resistance and exceptional electromechanical stability throughout the peeling process and cyclic vascular pulsation. The obtain helical sensor enables multi-parametric hemodynamic monitoring in vitro models and in vivo rat and rabbit models, capable of detecting intraoperative conditions such as hypertension, vasospasm, and vascular occlusion. These results demonstrate the helical vascular electronics as a versatile intraoperative tool for the timely identification of vascular complications, offering substantial potential to improve surgical outcomes in complex vascular procedures.
AB - Intraoperative monitoring of vascular and hemodynamic status is critical for preventing postoperative complications. However, interpatient variability in vessel geometry renders rigid or pre-shaped implantable sensors inadequate for conformal adaptation to the surgical site. Here, we present an intraoperatively customizable platform for the rapid fabrication of three-dimensional helical vascular electronics via a controlled mechanical peeling strategy. By modulating peeling parameters, helical structures with tunable diameters and pitches are generated, enabling suture-free wrapping around arteries of varying dimensions and branching architectures. Patterned Ag nanofiber electrodes were integrated via a water-assisted transfer method, exhibiting low electrical resistance and exceptional electromechanical stability throughout the peeling process and cyclic vascular pulsation. The obtain helical sensor enables multi-parametric hemodynamic monitoring in vitro models and in vivo rat and rabbit models, capable of detecting intraoperative conditions such as hypertension, vasospasm, and vascular occlusion. These results demonstrate the helical vascular electronics as a versatile intraoperative tool for the timely identification of vascular complications, offering substantial potential to improve surgical outcomes in complex vascular procedures.
KW - helical bioelectronics
KW - hemodynamic monitoring
KW - intraoperative customization
KW - mechanical peeling
KW - vascular complications
UR - https://www.scopus.com/pages/publications/105051216507
U2 - 10.1021/acsnano.6c08201
DO - 10.1021/acsnano.6c08201
M3 - Article
AN - SCOPUS:105051216507
SN - 1936-0851
VL - 20
SP - 24818
EP - 24829
JO - ACS Nano
JF - ACS Nano
IS - 36
ER -