TY - JOUR
T1 - High-fill-factor micromirror array with hidden bimorph actuators and TipTilt-Piston capability
AU - Jia, Kemiao
AU - Samuelson, Sean R.
AU - Xie, Huikai
PY - 2011/6
Y1 - 2011/6
N2 - This paper presents the design, fabrication, packaging, and characterization of a novel high-fill-factor micromirror array (MMA) actuated by electrothermal bimorphs. In this paper, 4×4 MMA devices with an 88% area fill factor at normal incidence, 1.5 mm \times 1.5 mm subaperture size, and single-crystal-silicon-supported mirror plates have been fabricated based on a single silicon-on-insulator wafer, without additional bonding/transfer processes. The bimorph actuators are hidden underneath the mirror plates, which are also protected by silicon walls. The MMA devices can directly be surface mounted onto driving circuit chips or printed circuit boards after fabrication. The subapertures can generate large tiptilt-piston scanning and can individually be addressed. Static characterizations of the packaged devices show that each subaperture can achieve a piston stroke of sim310muand optical deflection angles greater than \pm 25\circ in both the x- and y -axes, all at 8-V dc. The preliminary laser-steering optical-phased-array capability of the obtained MMA device has also experimentally been demonstrated. This paper is based on the conference proceedings presented at the 23rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2010), Hong Kong.
AB - This paper presents the design, fabrication, packaging, and characterization of a novel high-fill-factor micromirror array (MMA) actuated by electrothermal bimorphs. In this paper, 4×4 MMA devices with an 88% area fill factor at normal incidence, 1.5 mm \times 1.5 mm subaperture size, and single-crystal-silicon-supported mirror plates have been fabricated based on a single silicon-on-insulator wafer, without additional bonding/transfer processes. The bimorph actuators are hidden underneath the mirror plates, which are also protected by silicon walls. The MMA devices can directly be surface mounted onto driving circuit chips or printed circuit boards after fabrication. The subapertures can generate large tiptilt-piston scanning and can individually be addressed. Static characterizations of the packaged devices show that each subaperture can achieve a piston stroke of sim310muand optical deflection angles greater than \pm 25\circ in both the x- and y -axes, all at 8-V dc. The preliminary laser-steering optical-phased-array capability of the obtained MMA device has also experimentally been demonstrated. This paper is based on the conference proceedings presented at the 23rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2010), Hong Kong.
KW - Bimorph
KW - flip-chip packaging
KW - microelectromechanical systems (MEMS)
KW - micromirror
KW - micromirror array (MMA)
KW - microoptoelectromechanical systems (MOEMS)
KW - optical phased array (OPA)
KW - surface mounting
UR - http://www.scopus.com/inward/record.url?scp=79957985781&partnerID=8YFLogxK
U2 - 10.1109/JMEMS.2011.2127449
DO - 10.1109/JMEMS.2011.2127449
M3 - Article
AN - SCOPUS:79957985781
SN - 1057-7157
VL - 20
SP - 573
EP - 582
JO - Journal of Microelectromechanical Systems
JF - Journal of Microelectromechanical Systems
IS - 3
M1 - 5746491
ER -