TY - GEN
T1 - Five-pole LTCC cavity filter for wireless applications at 34GHz
AU - Yuan, Bo
AU - Mou, Jinchao
AU - Yu, Weihua
AU - Lv, Xin
PY - 2011
Y1 - 2011
N2 - System-on-Package (SOP) is presently the most effective method for realizing the miniaturization of wireless front-end applications. Band pass filter is one of the most important components in the SOP. In this paper, a 5-pole band pass cavity filter consisting of via walls was designed as a system-on-package solution for RF front-end modules at 34GHz, adopting low-temperature co-fired ceramics (LTCC). The BPF is vertically made up of five cavity resonators with via walls and has been simulated and optimized by Ansoft HFSS. This filter which has been realized in a seven layers ceramic substrate exhibits an insertion loss of 0.89 dB at the center frequency of 34 GHz, a rejection 37.5 dB(32.9GHz and 35.8GHZ), and 3dB bandwidth approximately 4.5%( 1.5 GHz). Due to its vertical structure, this filter shows promising application potentials in miniaturized SOP.
AB - System-on-Package (SOP) is presently the most effective method for realizing the miniaturization of wireless front-end applications. Band pass filter is one of the most important components in the SOP. In this paper, a 5-pole band pass cavity filter consisting of via walls was designed as a system-on-package solution for RF front-end modules at 34GHz, adopting low-temperature co-fired ceramics (LTCC). The BPF is vertically made up of five cavity resonators with via walls and has been simulated and optimized by Ansoft HFSS. This filter which has been realized in a seven layers ceramic substrate exhibits an insertion loss of 0.89 dB at the center frequency of 34 GHz, a rejection 37.5 dB(32.9GHz and 35.8GHZ), and 3dB bandwidth approximately 4.5%( 1.5 GHz). Due to its vertical structure, this filter shows promising application potentials in miniaturized SOP.
KW - Band Pass Filter (BPF)
KW - Low-Temperature Co-fired Ceramics (LTTC)
KW - System-on-Package (SOP)
KW - miniaturization
UR - https://www.scopus.com/pages/publications/79960374423
U2 - 10.1109/ICMTCE.2011.5915199
DO - 10.1109/ICMTCE.2011.5915199
M3 - Conference contribution
AN - SCOPUS:79960374423
SN - 9781424485574
T3 - ICMTCE2011 - Proceedings 2011 IEEE International Conference on Microwave Technology and Computational Electromagnetics
SP - 193
EP - 195
BT - ICMTCE2011 - Proceedings 2011 IEEE International Conference on Microwave Technology and Computational Electromagnetics
T2 - 2011 2nd IEEE International Conference on Microwave Technology and Computational Electromagnetics, ICMTCE2011
Y2 - 22 May 2011 through 25 May 2011
ER -