Fabrication and application of high-temperature digital image correlation deformation carriers with high bonding strength via soft imprinting technology

With the growing demand for high-temperature deformation measurements in industrial environments, digital image correlation technology has been widely applied due to its non-contact measurement capabilities. However, its accuracy and reliability heavily depend on the durability of the deformation carrier under extreme conditions. To address this challenge, this paper develops a method for preparing high-temperature deformation carriers that combines operational simplicity with high customizability. The proposed method utilizes soft imprinting technology, employing custom rubber stamps and high-temperature resistant ink. The rubber stamps feature tailored patterns (e.g., dot matrices) fabricated via computer numerical control machining, whereas the ink is formulated by mixing inorganic binders and refractory powders in an optimized ratio. During preparation, the pattern is transferred onto the specimen’s surface via imprinting, followed by a rapid pretreatment at 1500°C for 2 min to achieve robust carrier formation. This paper further analyzes the thermal resistance and vibration stability mechanisms of the proposed carrier. High-temperature durability is achieved by transforming the ink into a stable alumina-based ceramic framework after pretreatment, maintaining structural integrity under the tested conditions up to 2000°C. The ink penetrates surface pores to form strong mechanical interlocking and chemical interactions, ensuring robust interfacial adhesion. Meanwhile, the soft imprinting process facilitates a thinner and more uniform carrier layer, which minimizes the mass addition effect. To evaluate the reliability, high-temperature vibration experiments were conducted on the fabricated deformation carrier under coupled conditions of 2000°C and 20-g acceleration, successfully capturing the full-field displacement distributions and time-domain vibration responses. The results demonstrate that the carrier prepared by this method possesses significant advantages, including strong interfacial bonding strength and exceptional tolerance to extreme thermal–mechanical environments. Combined with its capability for rapid, large-scale, and customized preparation, the proposed method holds great potential for engineering applications in extreme environment monitoring.