Enhanced thermal conductivity and retained electrical insulation for polyimide composites with SiC nanowires grown on graphene hybrid fillers

Wen Dai; Jinhong Yu; Zhiduo Liu; Yi Wang; Yingze Song; Jilei Lyu; Hua Bai; Kazuhito Nishimura; Nan Jiang

doi:10.1016/j.compositesa.2015.05.017

Enhanced thermal conductivity and retained electrical insulation for polyimide composites with SiC nanowires grown on graphene hybrid fillers

Wen Dai
, Jinhong Yu^*
, Zhiduo Liu
, Yi Wang
, Yingze Song
, Jilei Lyu
, Hua Bai
, Kazuhito Nishimura
, Nan Jiang

^*此作品的通讯作者

CAS - Ningbo Institute of Material Technology and Engineering
Kogakuin University

科研成果: 期刊稿件 › 文章 › 同行评审

155 引用（Scopus）

摘要

Polyimide (PI) composites containing one-dimensional SiC nanowires grown on two-dimensional graphene sheets (1D-2D SiC_NWs-GSs) hybrid fillers were successfully prepared. The PI/SiC_NWs-GSs composites synchronously exhibited high thermal conductivity and retained electrical insulation. Moreover, the heat conducting properties of PI/SiC_NWs-GSs films present well reproducibility within the temperature range from 25 to 175 °C. The maximum value of thermal conductivity of PI composite is 0.577 W/mK with 7 wt% fillers loading, increased by 138% in comparison with that of the neat PI. The 1D SiC nanowires grown on the GSs surface prevent the GSs contacting with each other in the PI matrix to retain electrical insulation of PI composites. In addition, the storage modulus and Young's modulus of PI composites are remarkably improved in comparison with that of the neat PI.

源语言	英语
页（从-至）	73-81
页数	9
期刊	Composites Part A: Applied Science and Manufacturing
卷	76
DOI	https://doi.org/10.1016/j.compositesa.2015.05.017
出版状态	已出版 - 23 6月 2015
已对外发布	是

访问文件

10.1016/j.compositesa.2015.05.017

其它文件与链接

链接到 Scopus 的出版物

引用此

@article{10f9e0d0774e4b8894599855e3c8e07a,

title = "Enhanced thermal conductivity and retained electrical insulation for polyimide composites with SiC nanowires grown on graphene hybrid fillers",

abstract = "Polyimide (PI) composites containing one-dimensional SiC nanowires grown on two-dimensional graphene sheets (1D-2D SiCNWs-GSs) hybrid fillers were successfully prepared. The PI/SiCNWs-GSs composites synchronously exhibited high thermal conductivity and retained electrical insulation. Moreover, the heat conducting properties of PI/SiCNWs-GSs films present well reproducibility within the temperature range from 25 to 175 °C. The maximum value of thermal conductivity of PI composite is 0.577 W/mK with 7 wt\% fillers loading, increased by 138\% in comparison with that of the neat PI. The 1D SiC nanowires grown on the GSs surface prevent the GSs contacting with each other in the PI matrix to retain electrical insulation of PI composites. In addition, the storage modulus and Young's modulus of PI composites are remarkably improved in comparison with that of the neat PI.",

keywords = "A. Hybrid, A. Polymer-matrix composites (PMCs), B. Electrical properties, B. Thermal properties",

author = "Wen Dai and Jinhong Yu and Zhiduo Liu and Yi Wang and Yingze Song and Jilei Lyu and Hua Bai and Kazuhito Nishimura and Nan Jiang",

year = "2015",

month = jun,

day = "23",

doi = "10.1016/j.compositesa.2015.05.017",

language = "English",

volume = "76",

pages = "73--81",

journal = "Composites Part A: Applied Science and Manufacturing",

issn = "1359-835X",

publisher = "Elsevier Ltd.",

}

TY - JOUR

T1 - Enhanced thermal conductivity and retained electrical insulation for polyimide composites with SiC nanowires grown on graphene hybrid fillers

AU - Dai, Wen

AU - Yu, Jinhong

AU - Liu, Zhiduo

AU - Wang, Yi

AU - Song, Yingze

AU - Lyu, Jilei

AU - Bai, Hua

AU - Nishimura, Kazuhito

AU - Jiang, Nan

PY - 2015/6/23

Y1 - 2015/6/23

N2 - Polyimide (PI) composites containing one-dimensional SiC nanowires grown on two-dimensional graphene sheets (1D-2D SiCNWs-GSs) hybrid fillers were successfully prepared. The PI/SiCNWs-GSs composites synchronously exhibited high thermal conductivity and retained electrical insulation. Moreover, the heat conducting properties of PI/SiCNWs-GSs films present well reproducibility within the temperature range from 25 to 175 °C. The maximum value of thermal conductivity of PI composite is 0.577 W/mK with 7 wt% fillers loading, increased by 138% in comparison with that of the neat PI. The 1D SiC nanowires grown on the GSs surface prevent the GSs contacting with each other in the PI matrix to retain electrical insulation of PI composites. In addition, the storage modulus and Young's modulus of PI composites are remarkably improved in comparison with that of the neat PI.

AB - Polyimide (PI) composites containing one-dimensional SiC nanowires grown on two-dimensional graphene sheets (1D-2D SiCNWs-GSs) hybrid fillers were successfully prepared. The PI/SiCNWs-GSs composites synchronously exhibited high thermal conductivity and retained electrical insulation. Moreover, the heat conducting properties of PI/SiCNWs-GSs films present well reproducibility within the temperature range from 25 to 175 °C. The maximum value of thermal conductivity of PI composite is 0.577 W/mK with 7 wt% fillers loading, increased by 138% in comparison with that of the neat PI. The 1D SiC nanowires grown on the GSs surface prevent the GSs contacting with each other in the PI matrix to retain electrical insulation of PI composites. In addition, the storage modulus and Young's modulus of PI composites are remarkably improved in comparison with that of the neat PI.

KW - A. Hybrid

KW - A. Polymer-matrix composites (PMCs)

KW - B. Electrical properties

KW - B. Thermal properties

UR - https://www.scopus.com/pages/publications/84934909857

U2 - 10.1016/j.compositesa.2015.05.017

DO - 10.1016/j.compositesa.2015.05.017

M3 - Article

AN - SCOPUS:84934909857

SN - 1359-835X

VL - 76

SP - 73

EP - 81

JO - Composites Part A: Applied Science and Manufacturing

JF - Composites Part A: Applied Science and Manufacturing

ER -

Enhanced thermal conductivity and retained electrical insulation for polyimide composites with SiC nanowires grown on graphene hybrid fillers

摘要

访问文件

其它文件与链接

指纹

引用此