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Embedded Intelligence for a Low-Altitude Circular Economy: A Framework Fusing 3D Printing and Drone Swarms

  • Tong Qiu*
  • , Jingwei Ge
  • , Hui Zhang
  • , Lili Fan
  • , Yonglin Tian
  • , Fei Yue Wang
  • , Zrubka Zsombor
  • *此作品的通讯作者
  • Xinjiang University
  • Óbuda University
  • Beijing Jiaotong University
  • Beijing Institute of Technology
  • CAS - Institute of Automation
  • University of Chinese Academy of Sciences
  • Macau University of Science and Technology

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

摘要

As the low-altitude economy expands, driven by advancements in drone technology and additive manufacturing (3D printing), it faces significant environmental challenges, particularly increasing carbon emissions and hardware waste. These issues arise from the rapid growth and disposal of hardware in autonomous systems, which requires efficient and sustainable solutions. This paper introduces a novel Low-altitude Circular Economy Embedded Intelligence (LaSEE) framework, designed to address these challenges through the integration of drone swarms, 3D printing technology, and AI. The framework consists of three core components: the AI core, which makes real-time decisions based on comprehensive task analysis; 3D printing platforms, which manufacture and repair drone components on demand; and drone swarms, which collaborate to execute complex cross-domain tasks. These components work together to ensure efficient operations while minimizing waste, contributing to sustainability in the low-altitude economy. This novel framework offers a transformative solution by reducing environmental impact and enhancing operational flexibility, paving the way for a sustainable and adaptive future in autonomous systems. In addition, we explicitly incorporate hardware reliability, operational safety, and lifecycle cost into the AI-driven scheduling loop, thereby making the framework explicitly deployment-oriented for real-world low-altitude scenarios.

源语言英语
主期刊名2025 IEEE International Conference on Mechatronic and Embedded Systems and Applications, MESA 2025
出版商Institute of Electrical and Electronics Engineers Inc.
页148-153
页数6
ISBN(电子版)9798331575533
DOI
出版状态已出版 - 2025
已对外发布是
活动21st IEEE International Conference on Mechatronic and Embedded Systems and Applications, MESA 2025 - Macau, 中国
期限: 8 11月 2025 → 10 11月 2025

丛书

姓名2025 IEEE International Conference on Mechatronic and Embedded Systems and Applications, MESA 2025

会议

会议21st IEEE International Conference on Mechatronic and Embedded Systems and Applications, MESA 2025
国家/地区中国
市Macau
时期8/11/25 → 10/11/25

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